Abstract: Inwardly opposed piston, compression ignition engines are quiet, compact in size, and reliable.

Abstract: Inwardly opposed piston, compression ignition engines are quiet, compact in size, and reliable.

Abstract: Ruggedized generators can operate using both medium and heavy fuels and output at least 5 kWe of power, yet are quiet, compact in size, and reliable.

Abstract: Ruggedized generators can operate using both medium and heavy fuels and output at least 5 kWe of power, yet are quiet, compact in size, and reliable.

Abstract: Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated layered interface material having a migration component is also described herein and includes at least one pulse-plated thermally conductive material; and at least one heat spreader component, wherein the migration component of the plated layered interface material is reduced by at least 51% as compared to the migration component of a reference layered interface material. Another layered interface material described herein includes: a) a thermal conductor; b) a protective layer; c) a layer of material to accept solder and prevent the formation of oxides; and d) a layer of solder material.

Abstract: Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated layered interface material having a migration component is also described herein and includes at least one pulse-plated thermally conductive material; and at least one heat spreader component, wherein the migration component of the plated layered interface material is reduced by at least 51% as compared to the migration component of a reference layered interface material. Another layered interface material described herein includes: a) a thermal conductor; b) a protective layer; c) a layer of material to accept solder and prevent the formation of oxides; and d) a layer of solder material.

Abstract: Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated layered interface material having a migration component is also described herein and includes at least one pulse-plated thermally conductive material; and at least one heat spreader component, wherein the migration component of the plated layered interface material is reduced by at least 51% as compared to the migration component of a reference layered interface material. Another layered interface material described herein includes: a) a thermal conductor; b) a protective layer; c) a layer of material accept solder and prevent the formation of oxides; and d) a layer of solder material.

Abstract: Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated layered interface material having a migration component is also described herein and includes at least one pulse-plated thermally conductive material; and at least one heat spreader component, wherein the migration component of the plated layered interface material is reduced by at least 51% as compared to the migration component of a reference layered interface material. Another layered interface material described herein includes: a) a thermal conductor; b) a protective layer; c) a layer of material accept solder and prevent the formation of oxides; and d) a layer of solder material.

Abstract: A method for joining component bodies of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets of the reactive composite material are operatively connected by an ignitable bridging material so that an igniting reaction in one sheet will cause an igniting reaction in the other. An application of uniform pressure and an ignition of one or more of the contiguous sheets of reactive composite material causes an exothermic thermal reaction to propagate through the bonding region, fusing any adjacent sheets of fusible material and forming a bond between the component bodies.

Abstract: The invention encompasses microelectronic package lids, heat spreaders, and semiconductor packages comprising microelectronic lids or heat spreaders. In particular aspects of the present invention, a microelectronic lid comprises a material having a rectangular peripheral shape that defines 4 peripheral sides. Further, the lid has projecting peripheral rails along less than all of the peripheral edge. For instance, the lid can have projecting peripheral rails along only 2 of the sides. Alternatively, such microelectronic lid can be described as comprising a generally rectangular shape defining four peripheral edges, with two of the edges having a greater thickness than the other two edges.

Abstract: The invention encompasses microelectronic package lids, heat spreaders, and semiconductor packages comprising microelectronic lids or heat spreaders. In particular aspects of the present invention, a microelectronic lid comprises a material having a rectangular peripheral shape that defines 4 peripheral sides. Further, the lid has projecting peripheral rails along less than all of the peripheral edge. For instance, the lid can have projecting peripheral rails along only 2 of the sides. Alternatively, such microelectronic lid can be described as comprising a generally rectangular shape defining four peripheral edges, with two of the edges having a greater thickness than the other two edges.

Abstract: The invention encompasses microelectronic package lids, heat spreaders, and semiconductor packages comprising microelectronic lids or heat spreaders. In particular aspects of the present invention, a microelectronic lid comprises a material having a rectangular peripheral shape that defines 4 peripheral sides. Further, the lid has projecting peripheral rails along less than all of the peripheral edge. For instance, the lid can have projecting peripheral rails along only 2 of the sides. Alternatively, such microelectronic lid can be described as comprising a generally rectangular shape defining four peripheral edges, with two of the edges having a greater thickness than the other two edges.