Patents by Inventor Jay W. Kokas
Jay W. Kokas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240068407Abstract: A fuel injector for a turbine engine includes a fuel scheduling valve configured for regulation of fuel flow from a fuel inlet in response to fuel pressure received at the fuel inlet. Primary and secondary fuel circuits receive fuel from the scheduling valve, and an electrically-controlled valve is provided in fluid communication with the primary circuit, adapted and configured to actively control fuel through the primary circuit in response to a control signal.Type: ApplicationFiled: July 21, 2023Publication date: February 29, 2024Applicant: Collins Engine Nozzles, Inc.Inventors: Brandon P. Williams, Murtuza Lokhandwalla, Michael Ferrarotti, Todd Haugsjaahabink, Russell P. Rourke, JR., Jay W. Kokas, Richard E. Versailles, Jason A. Ryon, Charles E. Reuter
-
Publication number: 20240068408Abstract: A system includes an injector having a scheduling valve assembly and a nozzle in fluid communication with the valve assembly. The scheduling valve assembly is configured for regulation of flow from an inlet of the injector to the nozzle. The injector includes two fluid circuits between the inlet of the injector and two respective outlets of the nozzle for staged flow output from the nozzle. A first one of the two fluid circuits is a primary circuit, and a second one of the two fluid circuits is a secondary circuit. A solenoid valve is connected in fluid communication with the scheduling valve assembly, wherein the solenoid valve is configured to adjust position of a hydromechanical valve spool of the valve assembly.Type: ApplicationFiled: July 21, 2023Publication date: February 29, 2024Applicant: Collins Engine Nozzles, Inc.Inventors: Brandon P. Williams, Michael Ferrarotti, Murtuza Lokhandwalla, Todd Haugsjaahabink, Russell P. Rourke, Jr., Jay W. Kokas, Richard E. Versailles
-
Publication number: 20240066435Abstract: A method of forming a degassing system includes the step of forming a bundle of hollow tube membrane members by wrapping hollow tube membrane members to form the bundle at a temperature above 100° F. (38° C.). Another method of forming a degassing system includes the step of the inserting bundle into an outer canister at a temperature above 100° F. (38° C.). A fuel supply system made by these methods is also disclosed.Type: ApplicationFiled: August 26, 2022Publication date: February 29, 2024Inventors: Mark R. Gurvich, Richard E. Versailles, Jay W. Kokas, Rebecca R. Stoner, Andrew M Caldecutt, Alan F. Hunter, Haralambos Cordatos, Murtuza Lokhandwalla
-
Publication number: 20240068664Abstract: A fuel injector for a turbine engine includes a fuel scheduling valve configured for regulation of fuel flow from a fuel inlet, in response to fuel pressure received at the fuel inlet. Primary, secondary and auxiliary fuel circuits receive fuel from the scheduling valve, and an electrically-controlled valve is provided in fluid communication with the auxiliary circuit, which electrically-controlled valve is adapted and configured to actively control fuel through the auxiliary circuit in response to a control signal.Type: ApplicationFiled: July 21, 2023Publication date: February 29, 2024Applicant: Collins Engine Nozzles, Inc.Inventors: Brandon P. Williams, Michael Ferrarotti, Murtuza Lokhandwalla, Todd Haugsjaahabink, Russell P. Rourke, JR., Jay W. Kokas, Richard E. Versailles
-
Publication number: 20240068409Abstract: A system includes an injector including a scheduling valve assembly and a nozzle in fluid communication with the valve assembly. The scheduling valve assembly is configured for regulation of flow from an inlet of the injector to the nozzle. The injector includes one fluid circuit between the inlet of the injector and a respective outlet of the nozzle. A solenoid valve is connected in fluid communication with the scheduling valve assembly. The solenoid valve is configured to adjust position of a hydromechanical valve spool of the valve assembly.Type: ApplicationFiled: July 21, 2023Publication date: February 29, 2024Applicant: Collins Engine Nozzles, Inc.Inventors: Brandon P. Williams, Michael Ferrarotti, Murtuza Lokhandwalla, Todd Haugsjaahabink, Russell P. Rourke, JR., Jay W. Kokas, Richard E. Versailles
-
Publication number: 20240068413Abstract: A fuel injector for a turbine engine includes a fuel scheduling valve configured for regulation of fuel flow from a fuel inlet, in response to fuel pressure received at the fuel inlet. Primary, secondary and auxiliary fuel circuits receive fuel from the scheduling valve, and an electrically-controlled valve is provided in fluid communication with the auxiliary circuit, which electrically-controlled valve is adapted and configured to actively control fuel through the auxiliary circuit in response to a control signal. The auxiliary fuel circuit joins with the secondary fuel circuit for delivery to a fuel nozzle.Type: ApplicationFiled: July 21, 2023Publication date: February 29, 2024Applicant: Collins Engine Nozzles, Inc.Inventors: Brandon P. Williams, Michael Ferrarotti, Murtuza Lokhandwalla, Todd Haugsjaahabink, Russell P. Rourke, Jr., Jay W. Kokas, Richard E. Versailles
-
Publication number: 20230356112Abstract: A fiber de-gassing membrane includes a plurality of membrane fibers. At least one of the membrane fibers has a first stiffness. The membrane includes reinforcing fibers. The reinforcing fibers are positioned adjacent to at least one of the membrane fibers. The reinforcing fibers have a second stiffness. The second stiffness is greater than the first stiffness.Type: ApplicationFiled: May 3, 2022Publication date: November 9, 2023Inventors: Mark R. Gurvich, Jay W. Kokas, Rebecca R. Stoner, Andrew M. Caldecutt, Alan F. Hunter, Haralambos Cordatos, Murtuza Lokhandwalla
-
Patent number: 10473408Abstract: A heat exchanger is disclosed which includes a plurality of heat exchanger plates. Each plate has a plurality of hollowed out pins arranged in a pin fin pattern. Each plate also includes an inlet aperture and an outlet aperture in fluid communication with one another. A plurality of heat pipes are defined by several of the plurality of hollowed out pins. A wicking material is arranged within the several hollowed out pins. A heat transfer fluid at least partially fills each heat pipe.Type: GrantFiled: December 29, 2017Date of Patent: November 12, 2019Assignee: Hamilton Sundstrand CorporationInventors: Jay W. Kokas, Leo J. Veilleux, Jr., Rudolph Thomas Beaupre
-
Patent number: 10420203Abstract: An apparatus includes a heat sink and a post that supports the heat sink that is monolithically formed with the heat sink. The apparatus can further include a printed wiring board attached to a top side of the heat sink with electronic components attached to the printed wiring board, a plurality of posts integrated into a bottom side of the heat sink and extending outwards from the heat sink, wherein the heat sink and the plurality of posts are monolithically formed, and a heat pipe attached to the bottom side of the heat sink with a first end near an electronic component and a second end near one of the plurality of posts.Type: GrantFiled: July 1, 2013Date of Patent: September 17, 2019Assignee: Hamilton Sundstrand CorporationInventors: Jay W. Kokas, Kenneth J. Trotman, Kerry R. Querns, Rachel Farner
-
Patent number: 10017860Abstract: A component is provided including a body formed at least partially from a composite material. At least a portion of the composite material is covered by a plating. The plating includes a layer of electroless copper, a layer of electrolytic copper, a layer of nickel strike, and a finishing layer.Type: GrantFiled: February 19, 2014Date of Patent: July 10, 2018Assignee: HAMILTON SUNDSTRAND CORPORATIONInventors: Blair A. Smith, Kevin M. Rankin, Ricardo O. Brown, Jay W. Kokas
-
Publication number: 20180120038Abstract: A heat exchanger is disclosed which includes a plurality of heat exchanger plates. Each plate has a plurality of hollowed out pins arranged in a pin fin pattern. Each plate also includes an inlet aperture and an outlet aperture in fluid communication with one another. A plurality of heat pipes are defined by several of the plurality of hollowed out pins. A wicking material is arranged within the several hollowed out pins. A heat transfer fluid at least partially fills each heat pipe.Type: ApplicationFiled: December 29, 2017Publication date: May 3, 2018Inventors: Jay W. Kokas, Leo J. Veilleux, JR., Rudolph Thomas Beaupre
-
Patent number: 9863716Abstract: A heat exchanger is disclosed which includes a plurality of heat exchanger plates. Each plate has a plurality of hollowed out pins arranged in a pin fin pattern. Each plate also includes an inlet aperture and an outlet aperture in fluid communication with one another. A plurality of heat pipes are defined by several of the plurality of hollowed out pins. A wicking material is arranged within the several hollowed out pins. A heat transfer fluid at least partially fills each heat pipe.Type: GrantFiled: July 26, 2013Date of Patent: January 9, 2018Assignee: Hamilton Sundstrand CorporationInventors: Jay W Kokas, Leo J Veilleux, Jr., Rudolph Thomas Beaupre
-
Publication number: 20170042017Abstract: An apparatus includes a heat sink and a post that supports the heat sink that is monolithically formed with the heat sink. The apparatus can further include a printed wiring board attached to a top side of the heat sink with electronic components attached to the printed wiring board, a plurality of posts integrated into a bottom side of the heat sink and extending outwards from the heat sink, wherein the heat sink and the plurality of posts are monolithically formed, and a heat pipe attached to the bottom side of the heat sink with a first end near an electronic component and a second end near one of the plurality of posts.Type: ApplicationFiled: July 1, 2013Publication date: February 9, 2017Inventors: Jay W. Kokas, Kenneth J. Trotman, Kerry R. Querns, Rachel Farner
-
Publication number: 20160186328Abstract: A component is provided including a body formed at least partially from a composite material. At least a portion of the composite material is covered by a plating. The plating includes a layer of electroless copper, a layer of electrolytic copper, a layer of nickel strike, and a finishing layer.Type: ApplicationFiled: February 19, 2014Publication date: June 30, 2016Applicant: Hamilton Sundstrand CorporationInventors: Blair A. Smith, Kevin M. Rankin, Ricardo O. Brown, Jay W. Kokas
-
Patent number: 9198328Abstract: An electronics chassis for containing and supporting electronic components having different operating temperatures includes a plurality of thermally conductive walls forming an enclosure. There is a first heat dissipator in at least one of the walls having an external heat dissipator and a second heat dissipator in at least one of the walls having an external heat dissipator. There is a thermal isolator positioned in at least one of the walls to provide thermal isolation between the heat dissipators, and the thermal isolator includes a thermally insulating material.Type: GrantFiled: April 26, 2012Date of Patent: November 24, 2015Assignee: Hamilton Sundstrand CorporationInventors: Jay W. Kokas, Michael Maynard, Kerry R. Querns
-
Patent number: 9192043Abstract: An apparatus includes a printed wiring board, a post that supports the printed wiring board, and a heat pipe on the printed wiring board with a first end positioned near an electronic component attached to the printed wiring board and a second end positioned near the post.Type: GrantFiled: July 1, 2013Date of Patent: November 17, 2015Assignee: Hamilton Sundstrand CorporationInventors: Rachel Farner, Jay W. Kokas, Kenneth J. Trotman, Kerry R. Querns
-
Patent number: 9013879Abstract: An electronic component and cooling system has a printed wiring board, which is planar. An electrical component is mounted on one side of the planar surface of the printed wiring board. A hood is positioned outwardly of the electronic component. Legs on the hood extend to the printed wiring board, and form an inner surface that is positioned away from the one side relative to the electrical component. A chassis has posts connected to the printed wiring board and on an opposed side of the planar surface of the printed wiring board from the electrical component. The chassis extends to a remote portion, beyond the printed wiring board. A heat pipe is generally elongate and positioned on an opposed side of the hood from the electrical component. The heat pipe extends to the remote portion of the chassis to transfer heat from the hood to the chassis.Type: GrantFiled: December 4, 2012Date of Patent: April 21, 2015Assignee: Hamilton Sundstrand CorporationInventors: Rachel Farner, Kenneth J. Trotman, Jay W. Kokas, Kerry R. Querns
-
Publication number: 20150027669Abstract: A heat exchanger is disclosed which includes a plurality of heat exchanger plates. Each plate has a plurality of hollowed out pins arranged in a pin fin pattern. Each plate also includes an inlet aperture and an outlet aperture in fluid communication with one another. A plurality of heat pipes are defined by several of the plurality of hollowed out pins. A wicking material is arranged within the several hollowed out pins. A heat transfer fluid at least partially fills each heat pipe.Type: ApplicationFiled: July 26, 2013Publication date: January 29, 2015Applicant: Hamilton Sundstrand CorporationInventors: Jay W Kokas, Leo J Veilleux, JR., Rudolph Thomas Beaupre
-
Publication number: 20150000961Abstract: An apparatus includes a printed wiring board, a post that supports the printed wiring board, and a heat pipe on the printed wiring board with a first end positioned near an electronic component attached to the printed wiring board and a second end positioned near the post.Type: ApplicationFiled: July 1, 2013Publication date: January 1, 2015Inventors: Rachel Farner, Jay W. Kokas, Kenneth J. Trotman, Kerry R. Querns
-
Publication number: 20150000871Abstract: A device with increased heat dissipation abilities for supporting printed wiring boards includes a chassis for holding printed wiring boards, a plurality of fins attached to the chassis, and a heat pipe in each of the plurality of fins that is capable of transferring heat from the chassis to the surrounding ambient by absorbing heat from the chassis at a first end of the heat pipe and releasing the heat into the ambient at a second end of the heat pipe.Type: ApplicationFiled: July 1, 2013Publication date: January 1, 2015Inventors: Rachel Farner, Jay W. Kokas, Kenneth J. Trotman, Kerry R. Querns