Abstract: A system and method for receiving, using one or more processors, a set of sequences including a first sequence; receiving, using the one or more processors, a set of content associated with the first sequence, the set of content including first content associated with a first panel and second content associated with a second panel; receiving, using the one or more processors, a set of interactions associated with the first sequence, the set of interactions including a first trigger; and generating, using the one or more processors, a simulation based on the received set of sequences, the set of content, and the set of interactions.

Abstract: A system and method tor receiving, using one or more processors, a set of sequences including a first sequence; receiving, using the one or more processors, a set of content associated with the first sequence, the set of content including first content associated with a first panel and second content associated with a second panel; receiving, using the one or more processors, a set of interactions associated with the first sequence, the set of interactions including a first trigger; and generating, using the one or more processors, a simulation based on the received set of sequences, the set of content, and the set of interactions.

Abstract: An improved package device simulator for the testing of testing sockets, the package device simulator being formed of a first layer of non-conductive rigid substrate with a second layer formed of a plurality of electrically conductive traces being added thereto. A third layer of non-conductive rigid substrate is adhered to the first layer with the second layer being sealed there between. The third layer having a plurality of openings therein, wherein the openings align with and expose a portion of the electrically conductive traces of the second layer. Conductive binding material and contact balls are added to the openings and the chip is cured thereby fusing the contact balls with the exposed portions of the traces. Next, the exposed surfaces are coated with a hardening conductive material, such as layers of Nickel and/or Gold. In this way an improved package device simulator is formed that is durable, easier to manufacture and less expensive than a solid metallic package device simulator.

Abstract: A method and apparatus for (a) receiving a three-dimensional (3D) point cloud from a depth sensor that is oriented towards an open end of a shipping container, the point cloud comprising a plurality of points that each have a respective depth value, (b) segmenting the received 3D point cloud among a plurality of grid elements, (c) calculating a respective loaded-container-portion grid-element volume for each grid element, (d) calculating a loaded-container-portion volume of the shipping container by aggregating the calculated respective loaded-container-portion grid-element volumes, (e) calculating an estimated fullness of the shipping container based on the loaded-container-portion volume and a capacity of the shipping container; and (f) outputting the calculated estimated fullness of the shipping container.

Abstract: A method and apparatus for (a) receiving a three-dimensional (3D) point cloud from a depth sensor that is oriented towards an open end of a shipping container, the point cloud comprising a plurality of points that each have a respective depth value, (b) segmenting the received 3D point cloud among a plurality of grid elements, (c) calculating a respective loaded-container-portion grid-element volume for each grid element, (d) calculating a loaded-container-portion volume of the shipping container by aggregating the calculated respective loaded-container-portion grid-element volumes, (e) calculating an estimated fullness of the shipping container based on the loaded-container-portion volume and a capacity of the shipping container; and (f) outputting the calculated estimated fullness of the shipping container.

Abstract: A method and apparatus for (a) receiving a three-dimensional (3D) point cloud from a depth sensor that is oriented towards an open end of a shipping container, the point cloud comprising a plurality of points that each have a respective depth value, (b) segmenting the received 3D point cloud among a plurality of grid elements, (c) calculating a respective loaded-container-portion grid-element volume for each grid element, (d) calculating a loaded-container-portion volume of the shipping container by aggregating the calculated respective loaded-container-portion grid-element volumes, (e) calculating an estimated fullness of the shipping container based on the loaded-container-portion volume and a capacity of the shipping container; and (f) outputting the calculated estimated fullness of the shipping container.

Abstract: A method and apparatus for (a) receiving a three-dimensional (3D) point cloud from a depth sensor that is oriented towards an open end of a shipping container, the point cloud comprising a plurality of points that each have a respective depth value, (b) segmenting the received 3D point cloud among a plurality of grid elements, (c) calculating a respective loaded-container-portion grid-element volume for each grid element, (d) calculating a loaded-container-portion volume of the shipping container by aggregating the calculated respective loaded-container-portion grid-element volumes, (e) calculating an estimated fullness of the shipping container based on the loaded-container-portion volume and a capacity of the shipping container; and (f) outputting the calculated estimated fullness of the shipping container.

Abstract: An improved package device simulator for the testing of testing sockets, the package device simulator being formed of a first layer of non-conductive rigid substrate with a second layer formed of a plurality of electrically conductive traces being added thereto. A third layer of non-conductive rigid substrate is adhered to the first layer with the second layer being sealed there between. The third layer having a plurality of openings therein, wherein the openings align with and expose a portion of the electrically conductive traces of the second layer. Conductive binding material and contact balls are added to the openings and the chip is cured thereby fusing the contact balls with the exposed portions of the traces. Next, the exposed surfaces are coated with a hardening conductive material, such as layers of Nickel and/or Gold. In this way an improved package device simulator is formed that is durable, easier to manufacture and less expensive than a solid metallic package device simulator.

Abstract: A method and apparatus for communicating data to a browsing session is disclosed In one embodiment, the method comprises receiving a first information from a first browsing session in a proxy, the first information comprising a request for a webpage having at least one webpage element, transmitting a second information comprising a first wrapper distinct from the requested webpage, establishing a first communications session between the first wrapper and the proxy; and transmitting a third information to the first browser via the first communications session, the third information comprising at least one element based on the requested webpage element for rendering by the first browsing session via the first wrapper.

Abstract: Methods and systems are described for making posts and kerfs in an interdigital bonded composite. The desired alignment criteria for a plurality of posts and kerfs in a pair of slabs are determined, as well as the desired widths W of the posts and the desired widths K of the kerfs. The posts in the first slab are configured to be received into corresponding kerfs in the second slab, and vice versa, so that the pair of slabs can be interdigitated to generate a composite. At least one of an alignment post and an alignment kerf are created, in at least one of the slabs. The alignment posts and the alignment kerf are configured to allow the plurality of posts and kerfs to be correctly positioned and aligned, in accordance with the desired alignment criteria.

Abstract: A method of power administration includes monitoring at least one of a plurality of operating conditions relating to a plurality of outlets within a power distribution unit, determining whether a pre-determined operating condition threshold has been met, and, if the pre-determined threshold has been mete powering off less than all of the power outlets within the power distribution unit.

Abstract: A method is provided for decoding an image of a pattern on an object to determine a digital identifier. An image of a pattern on the object is received. The image includes a plurality of pixels, each of the pixels having an optical attribute with a corresponding value. The image is divided into a plurality of tiles, each of the tiles containing a contiguous plurality of the pixels of the image. A digital bit is assigned to each of the tiles based on the values of the optical attribute of the pixels in the tile. A digital identifier is determined based on the digital bits assigned to the tiles.

Abstract: A method is provided for delivering information content relating to an object. A first image of a pattern on the object is received. An outer border of the first image is detected, and a second image framed by the outer border is located. The second image is decoded to determine a digital identifier. Information content relating to the digital identifier is delivered.

Abstract: The present disclosure provides methods, systems, and apparatus for communicating with an electronic device. Particular disclosed embodiments provide a system that includes a peripheral communications adapter communicatingly connectable to an electronic device. The peripheral communications adapter includes a first communications interface, a second communications adapter communicatingly connectable with the electronic device, a memory, and a processor. The system also includes a controller in communications with the first communications interface. The controller includes a network adapter connectable to a network, a first communication port communicatingly connectable to the first communications interface, and a processor. The systems allows a remote user to monitor or control the electronic device over the network.