Publication number: 20260047043
Abstract: Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An immersion cooling chassis includes a first face, a second face opposite the first face, a third face disposed between the first face and the second face, the third face perpendicular to the first face, a fourth face disposed between the first face and the second face, the fourth face perpendicular to the first face and opposite the third face, and a first portion to be cooled via a first convection of a coolant fluid, the first portion including a coolant inlet defined in the third face, and a coolant outlet defined in the first face, and a second portion to be cooled via a second convection of air, the second portion including an air inlet defined in the first face between the fourth face and the coolant outlet.
Type:
Application
Filed:
September 30, 2022
Publication date:
February 12, 2026
Applicant:
Intel Corporation
Inventors:
Thomas Birch, Jimmy Chuang, Yuehong Fan, Jing-Hua John He, Eric McAfee, Suchismita Sarangi, David Shia, Ming Tien, Chuanlou Wang, Peng Wei, Casey Winkel, Berhanu Wondimu, Dong-Han Wu, Jay Wu, Shaorong Zhou