Abstract: A determination is made that error-correcting code functionality detected a first number of erroneous bits within a memory device. Bits within the memory device are evaluated to identify a subset of the bits as candidate bits. The candidate bits are evaluated to determine whether the error-correcting code functionality returns a non-error state, where no error correction is performed, based upon one or more combinations of candidate bits being inverted. Responsive to the error-correcting code functionality returning the non-error state for only one combination of the one or more combinations of candidate bits being inverted, the one combination of candidate bits is corrected.

Abstract: A determination is made that error-correcting code functionality detected a first number of erroneous bits within a memory device. Bits within the memory device are evaluated to identify a subset of the bits as candidate bits. The candidate bits are evaluated to determine whether the error-correcting code functionality returns a non-error state, where no error correction is performed, based upon one or more combinations of candidate bits being inverted. Responsive to the error-correcting code functionality returning the non-error state for only one combination of the one or more combinations of candidate bits being inverted, the one combination of candidate bits is corrected.

Abstract: A method of dicing a semiconductor wafer includes forming a layer stack on a first main surface of a substrate. The layer stack and a portion of the substrate are etched according to a pattern defining an intended dicing location to obtain a trench structure. The substrate is irradiated with a laser beam to locally modify the substrate between a bottom of the trench structure and a second main surface of the substrate opposite to the first main surface.

Abstract: A method of dicing a semiconductor wafer includes forming a layer stack on a first main surface of a substrate. The layer stack and a portion of the substrate are etched according to a pattern defining an intended dicing location to obtain a trench structure. The substrate is irradiated with a laser beam to locally modify the substrate between a bottom of the trench structure and a second main surface of the substrate opposite to the first main surface.

Abstract: A method of dicing a semiconductor wafer includes forming a layer stack on a first main surface of a substrate. The layer stack and a portion of the substrate are etched according to a pattern defining an intended dicing location to obtain a trench structure. The substrate is irradiated with a laser beam to locally modify the substrate between a bottom of the trench structure and a second main surface of the substrate opposite to the first main surface.