Patents by Inventor Jayakumar Gurusamy
Jayakumar Gurusamy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140273756Abstract: A substrate precession apparatus for a carrier head is provided. The apparatus enables substrate precession, which is the rotational movement of the substrate relative to the carrier head during polishing of the substrate. The carrier head and a retaining ring assembly may be de-coupled and move independently of one another to promote substrate precession during a CMP process.Type: ApplicationFiled: March 14, 2013Publication date: September 18, 2014Inventors: Chih Hung CHEN, Gautam Shashank DANDAVATE, Jayakumar GURUSAMY, Samuel Chu-Chiang HSU
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Patent number: 6983096Abstract: A device for attenuating cladding modes in a single mode optical fiber is disclosed. The device comprises two supports, each equipped with spaced apart corrugations. The optical fiber lies transversely across the corrugations and the two supports are clamped together to impart micro-bends to the optical fiber. The resulting micro-bends provide excellent cladding mode attenuation and the spacing of the corrugations and support members can be adjusted so that the core modes are not attenuated.Type: GrantFiled: April 15, 2003Date of Patent: January 3, 2006Assignee: Intel CorporationInventors: Mario Pacheco, Marc A. Finot, Jayakumar Gurusamy
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Patent number: 6951511Abstract: Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure allows the frame assembly to be moved in relation to the platen. When the frame assembly is in an extended position relative to the platen, the web is placed in a spaced-apart relation to the platen.Type: GrantFiled: October 17, 2002Date of Patent: October 4, 2005Assignee: Applied Materials Inc.Inventors: Jayakumar Gurusamy, Gee Sun Hoey, Lawrence M. Rosenberg
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Patent number: 6901201Abstract: A fiber-flexure-substrate tray for transporting and protecting optical modules and optical module components. The fiber-flexture substrate tray may have a tray body for supporting an optical fiber and other components coupled to the optical fiber while the optical fiber and the other components are processed. In addition, the fiber-flexure-substrate tray may have a thermally conductive substrate holder coupled to the tray body for heat-treating other components coupled to the optical fiber. The tray body may have a support area designed to hold the optical fiber off of the thermally conductive substrate holder to thermally isolate the optical fiber. In addition, a component may be coupled to the tray to hold the optical fiber off of the thermally conductive substrate holder.Type: GrantFiled: March 29, 2002Date of Patent: May 31, 2005Assignee: Intel CorporationInventors: Jayakumar Gurusamy, Marc Epitaux, Ken Fukui
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Publication number: 20040208437Abstract: A device for attenuating cladding modes in a single mode optical fiber is disclosed. The device comprises two supports, each equipped with spaced apart corrugations. The optical fiber lies transversely across the corrugations and the two supports are clamped together to impart micro-bends to the optical fiber. The resulting micro-bends provide excellent cladding mode attenuation and the spacing of the corrugations and support members can be adjusted so that the core modes are not attenuated.Type: ApplicationFiled: April 15, 2003Publication date: October 21, 2004Inventors: Mario Pacheco, Marc A. Finot, Jayakumar Gurusamy
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Patent number: 6659849Abstract: Generally, a method and apparatus for cleaning a backside of a web of polishing material. In one embodiment, the apparatus includes a platen having a support surface adapted to support the backside the web and a web cleaner disposed on the platen and adjacent the backside of the web. A method for cleaning a web of polishing material is also provided. In one embodiment, the method includes the steps of supporting a portion of the web of polishing media on a platen, advancing a portion of the web onto the platen, and cleaning the unrolled portion of the web.Type: GrantFiled: November 3, 2000Date of Patent: December 9, 2003Assignee: Applied Materials Inc.Inventors: Shijian Li, Jayakumar Gurusamy, Manoocher Birang, Fred C. Redeker
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Publication number: 20030185538Abstract: A fiber-flexure-substrate tray for transporting and protecting optical modules and optical module components. The fiber-flexture substrate tray may have a tray body for supporting an optical fiber and other components coupled to the optical fiber while the optical fiber and the other components are processed. In addition, the fiber-flexure-substrate tray may have a thermally conductive substrate holder coupled to the tray body for heat-treating other components coupled to the optical fiber. The tray body may have a support area designed to hold the optical fiber off of the thermally conductive substrate holder to thermally isolate the optical fiber. In addition, a component may be coupled to the tray to hold the optical fiber off of the thermally conductive substrate holder.Type: ApplicationFiled: March 29, 2002Publication date: October 2, 2003Inventors: Jayakumar Gurusamy, Marc Epitaux, Ken Fukui
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Patent number: 6612914Abstract: Generally, a method and apparatus for retaining a web of polishing material is provided. In one embodiment, an apparatus for retaining a web of polishing material includes a platen that has a first clamp and a second clamp disposed on opposite sides of the platen. A top surface of the platen is adapted to support the web of polishing material in an orientation having the web's edges disposed approximate the first and second sides of the platen. The first and second clamps are actuated to laterally tension the web therebetween.Type: GrantFiled: December 14, 2000Date of Patent: September 2, 2003Assignee: Applied Materials Inc.Inventors: Jayakumar Gurusamy, Gee Sun Hoey
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Publication number: 20030060134Abstract: Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure allows the frame assembly to be moved in relation to the platen. When the frame assembly is in an extended position relative to the platen, the web is placed in a spaced-apart relation to the platen.Type: ApplicationFiled: October 17, 2002Publication date: March 27, 2003Applicant: Applied Materials, Inc.Inventors: Jayakumar Gurusamy, Gee Sun Hoey, Lawrence M. Rosenberg
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Patent number: 6482072Abstract: Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure allows the frame assembly to be moved in relation to the platen. When the frame assembly is in an extended position relative to the platen, the web is placed in a spaced-apart relation to the platen.Type: GrantFiled: October 26, 2000Date of Patent: November 19, 2002Assignee: Applied Materials, Inc.Inventors: Jayakumar Gurusamy, Gee Sun Hoey, Lawrence M. Rosenberg
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Publication number: 20020127959Abstract: Generally, a method and apparatus for retaining a web of polishing material is provided. In one embodiment, an apparatus for retaining a web of polishing material includes a platen that has a first clamp and a second clamp disposed on opposite sides of the platen. A top surface of the platen is adapted to support the web of polishing material in an orientation having the web's edges disposed approximate the first and second sides of the platen. The first and second clamps are actuated to laterally tension the web therebetween.Type: ApplicationFiled: December 14, 2000Publication date: September 12, 2002Applicant: Applied Materials, Inc.Inventors: Jayakumar Gurusamy, Gee Sun Hoey
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Patent number: 6419559Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a feed roller located in a cavity in the platen, a take-up roller, and a generally linear polishing sheet releasably secured to the platen to rotate with the platen. The polishing sheet has an exposed portion extending over a top surface of the platen for polishing the substrate, an unused portion wound around the feed roller, and a used portion wound around the take-up roller. A gas source direct a purge gas into the cavity containing the feed roller.Type: GrantFiled: July 9, 2001Date of Patent: July 16, 2002Assignee: Applied Materials, Inc.Inventors: Jayakumar Gurusamy, Gee Sun Hoey
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Publication number: 20020045406Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a feed roller located in a cavity in the platen, a take-up roller, and a generally linear polishing sheet releasably secured to the platen to rotate with the platen. The polishing sheet has an exposed portion extending over a top surface of the platen for polishing the substrate, an unused portion wound around the feed roller, and a used portion wound around the take-up roller. A gas source direct a purge gas into the cavity containing the feed roller.Type: ApplicationFiled: July 9, 2001Publication date: April 18, 2002Inventors: Jayakumar Gurusamy, Gee Sun Hoey
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Patent number: 6361423Abstract: A conditioner head for conditioning the polishing surface of a polishing pad. The conditioner head includes a drive element carried for rotation about a longitudinal axis and a disk backing element. The disk backing element carries an abrasive disk and holds the lower surface of the disk in engagement with the polishing pad. The conditioner head further includes a driven element coupling the disk backing element to the drive element to transmit torque and rotation therebetween. The driven element is longitudinally movable between retracted and extended positions. An annular diaphragm spans a gap between the drive element and the driven element and is coupled to the drive element and to the driven element to rotate therewith as a unit.Type: GrantFiled: December 22, 2000Date of Patent: March 26, 2002Assignee: Applied Materials, Inc.Inventors: Jayakumar Gurusamy, Lawrence M. Rosenberg
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Publication number: 20020016136Abstract: An apparatus and method for conditioning a polishing pad in a polishing system. One embodiment of the apparatus generally includes a movable support member, a conditioner device coupled to the support member, and a first actuator coupled to the support member and adapted to move the conditioner device along a first path. Another embodiment of the apparatus generally includes a platen, a polishing pad supported on the platen, and a conditioner device coupled to a support member and positioned adjacent a region of the polishing pad outside of a substrate polishing area. One embodiment of the method includes raising a conditioner device adjacent to the polishing pad, providing relational movement between the conditioner device and the polishing pad, and lowering the conditioner device away from the polishing pad.Type: ApplicationFiled: June 15, 2001Publication date: February 7, 2002Inventors: Manoocher Birang, Jayakumar Gurusamy, Gee Sun Hoey
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Patent number: 6299511Abstract: A conditioner head uses a fluid purge system to prevent debris from entering openings in the conditioner head and causing deterioration of bearings and other moving components in the conditioner head. The fluid may be a gas, such as nitrogen, or a liquid, such as water or reactive solvents.Type: GrantFiled: January 21, 2000Date of Patent: October 9, 2001Assignee: Applied Materials, Inc.Inventors: Jayakumar Gurusamy, Lawrence M. Rosenberg, Alexander Medvinsky
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Publication number: 20010001301Abstract: A conditioner head for conditioning the polishing surface of a polishing pad. The conditioner head includes a drive element carried for rotation about a longitudinal axis and a disk backing element. The disk backing element carries an abrasive disk and holds the lower surface of the disk in engagement with the polishing pad. The conditioner head further includes a driven element coupling the disk backing element to the drive element to transmit torque and rotation therebetween. The driven element is longitudinally movable between retracted and extended positions. An annular diaphragm spans a gap between the drive element and the driven element and is coupled to the drive element and to the driven element to rotate therewith as a unit.Type: ApplicationFiled: December 22, 2000Publication date: May 17, 2001Applicant: Applied Materials, Inc.,Inventors: Jayakumar Gurusamy, Lawrence M. Rosenberg
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Patent number: 6200199Abstract: A conditioner head for conditioning the polishing surface of a polishing pad. The conditioner head includes a drive element carried for rotation about a longitudinal axis and a disk backing element. The disk backing element carries an abrasive disk and holds the lower surface of the disk in engagement with the polishing pad. The conditioner head further includes a driven element coupling the disk backing element to the drive element to transmit torque and rotation therebetween. The driven element is longitudinally movable between retracted and extended positions. An annular diaphragm spans a gap between the drive element and the driven element and is coupled to the drive element and to the driven element to rotate therewith as a unit.Type: GrantFiled: March 31, 1998Date of Patent: March 13, 2001Assignee: Applied Materials, Inc.Inventors: Jayakumar Gurusamy, Lawrence M. Rosenberg
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Patent number: 6033290Abstract: A conditioner head uses a fluid purge system to prevent debris from entering openings in the conditioner head and causing deterioration of bearings and other moving components in the conditioner head. The fluid may be a gas, such as nitrogen, or a liquid, such as water or reactive solvents.Type: GrantFiled: September 29, 1998Date of Patent: March 7, 2000Assignee: Applied Materials, Inc.Inventors: Jayakumar Gurusamy, Lawrence M. Rosenberg, Alexander Medvinsky