Patents by Inventor Jayanta Sankar Kapat
Jayanta Sankar Kapat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8371134Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: GrantFiled: June 30, 2009Date of Patent: February 12, 2013Assignee: Rini Technologies, Inc.Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
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Patent number: 8024942Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: GrantFiled: December 21, 2007Date of Patent: September 27, 2011Assignee: Rini Technologies, Inc.Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
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Patent number: 7942642Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: GrantFiled: June 30, 2009Date of Patent: May 17, 2011Assignee: Rini Technologies, Inc.Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
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Patent number: 7921664Abstract: The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat.Type: GrantFiled: March 11, 2008Date of Patent: April 12, 2011Assignee: Rini Technologies, Inc.Inventors: Daniel P. Rini, H. Randolph Anderson, Jayanta Sankar Kapat, Louis Chow, Bradley G. Carman, Benjamin A. Saarloos
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Publication number: 20100293993Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: ApplicationFiled: December 21, 2007Publication date: November 25, 2010Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
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Publication number: 20100071390Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: ApplicationFiled: June 30, 2009Publication date: March 25, 2010Applicant: Rini Technologies, Inc.Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
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Publication number: 20100071389Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: ApplicationFiled: June 30, 2009Publication date: March 25, 2010Applicant: Rini Technologies, Inc.Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
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Patent number: 7654100Abstract: The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat.Type: GrantFiled: December 16, 2005Date of Patent: February 2, 2010Assignee: Rini Technologies, Inc.Inventors: Daniel P. Rini, H. Randolph Anderson, Jayanta Sankar Kapat, Louis Chow, Bradley G. Carman, Benjamin A. Saarloos
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Publication number: 20080210406Abstract: The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat.Type: ApplicationFiled: March 11, 2008Publication date: September 4, 2008Inventors: Daniel P. Rini, H. Randolph Anderson, Jayanta Sankar Kapat, Louis Chow, Bradley G. Carman, Benjamin A. Saarloos
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Patent number: 7318325Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: GrantFiled: January 31, 2006Date of Patent: January 15, 2008Assignee: Rini Technologies, Inc.Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
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Patent number: 7010936Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: GrantFiled: July 22, 2003Date of Patent: March 14, 2006Assignee: Rini Technologies, Inc.Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
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Patent number: 6993926Abstract: The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat.Type: GrantFiled: January 22, 2003Date of Patent: February 7, 2006Assignee: Rini Technologies, Inc.Inventors: Daniel P. Rini, H. Randolph Anderson, Jayanta Sankar Kapat, Louis Chow
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Publication number: 20040129018Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.Type: ApplicationFiled: July 22, 2003Publication date: July 8, 2004Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
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Patent number: 6571569Abstract: The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat.Type: GrantFiled: April 2, 2002Date of Patent: June 3, 2003Assignee: Rini Technologies, Inc.Inventors: Daniel P. Rini, H. Randolph Anderson, Jayanta Sankar Kapat, Louis Chow