Abstract: An Integrated Circuit (IC) package is provided, comprising a first IC die having a first capacitor and a logic circuit, and a second IC die having a second capacitor. The first IC die and the second IC die may be stacked within the IC package one on top of another and electrically coupled with die-to-die interconnects. The logic circuit is electrically coupled in a power delivery network to the first capacitor and the second capacitor. The first IC die and the second IC die include respective back-end-of-line portions in which the first capacitor and the second capacitor, which may comprise metal-insulator-metal capacitors in some embodiments are situated. In some embodiments, the second capacitor is situated in a shadow of the logic circuit. In various embodiments, the first IC die and the second IC die comprise any suitable pair in a plurality of stacked IC dies within an IC package.