Patents by Inventor Jaydeep K. Sinha
Jaydeep K. Sinha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11761880Abstract: Systems and methods for prediction and measurement of overlay errors are disclosed. Process-induced overlay errors may be predicted or measured utilizing film force based computational mechanics models. More specifically, information with respect to the distribution of film force is provided to a finite element (FE) model to provide more accurate point-by-point predictions in cases where complex stress patterns are present. Enhanced prediction and measurement of wafer geometry induced overlay errors are also disclosed.Type: GrantFiled: August 5, 2019Date of Patent: September 19, 2023Assignee: KLA CorporationInventors: Pradeep Vukkadala, Haiguang Chen, Jaydeep K. Sinha, Sathish Veeraraghavan
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Publication number: 20190353582Abstract: Systems and methods for prediction and measurement of overlay errors are disclosed. Process-induced overlay errors may be predicted or measured utilizing film force based computational mechanics models. More specifically, information with respect to the distribution of film force is provided to a finite element (FE) model to provide more accurate point-by-point predictions in cases where complex stress patterns are present. Enhanced prediction and measurement of wafer geometry induced overlay errors are also disclosed.Type: ApplicationFiled: August 5, 2019Publication date: November 21, 2019Inventors: Pradeep Vukkadala, Haiguang Chen, Jaydeep K. Sinha, Sathish Veeraraghavan
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Patent number: 10330608Abstract: Systems and methods for providing micro defect inspection capabilities for optical systems such as wafer metrology tools and interferometer systems are disclosed. The systems and methods in accordance with the present disclosure may detect, classify and quantify wafer surface features, wherein the detected defects are classified and the important defect metrology information of height/depth, area and volume is reported. The systems and methods in accordance with the present disclosure therefore provide more values for quantifying the negative effect of these defects on the wafer quality.Type: GrantFiled: May 11, 2012Date of Patent: June 25, 2019Assignee: KLA-Tencor CorporationInventors: Haiguang Chen, Jaydeep K. Sinha, Sergey Kamensky
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Patent number: 10249523Abstract: The present invention may include acquiring a wafer shape value at a plurality of points of a wafer surface at a first and second process level, generating a wafer shape change value at each of the points, generating a set of slope of shape change values at each of the points, calculating a set of process tool correctables utilizing the generated set of slope of shape change values, generating a set of slope shape change residuals (SSCRs) by calculating a slope of shape change residual value at each of the points utilizing the set of process tool correctables, defining a plurality of metric analysis regions distributed across the surface, and then generating one or more residual slope shape change metrics for each metric analysis region based on one or more SSCRs within each metric analysis region.Type: GrantFiled: April 21, 2016Date of Patent: April 2, 2019Assignee: KLA-Tencor CorporationInventors: Pradeep Vukkadala, Sathish Veeraraghavan, Jaydeep K. Sinha
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Patent number: 9588441Abstract: A method and apparatus for process control in the processing of a substrate is disclosed in the present invention. Embodiments of the present invention utilize a first analysis tool to determine changes in a substrate's geometry. The substrate geometry data is used to generate sampling plan that will be used to check areas of the substrate that are likely to have errors after processing. The sampling plan is fed forwards to a second analysis tool that samples the substrate after it has been processed. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: GrantFiled: May 18, 2012Date of Patent: March 7, 2017Assignee: KLA-TENCOR CORPORATIONInventors: Craig W. MacNaughton, Jaydeep K. Sinha
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Publication number: 20160372353Abstract: The present invention may include acquiring a wafer shape value at a plurality of points of a wafer surface at a first and second process level, generating a wafer shape change value at each of the points, generating a set of slope of shape change values at each of the points, calculating a set of process tool correctables utilizing the generated set of slope of shape change values, generating a set of slope shape change residuals (SSCRs) by calculating a slope of shape change residual value at each of the points utilizing the set of process tool correctables, defining a plurality of metric analysis regions distributed across the surface, and then generating one or more residual slope shape change metrics for each metric analysis region based on one or more SSCRs within each metric analysis region.Type: ApplicationFiled: April 21, 2016Publication date: December 22, 2016Inventors: Pradeep Vukkadala, Sathish Veeraraghavan, Jaydeep K. Sinha
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Patent number: 9354526Abstract: The present invention may include acquiring a wafer shape value at a plurality of points of a wafer surface at a first and second process level, generating a wafer shape change value at each of the points, generating a set of slope of shape change values at each of the points, calculating a set of process tool correctables utilizing the generated set of slope of shape change values, generating a set of slope shape change residuals (SSCRs) by calculating a slope of shape change residual value at each of the points utilizing the set of process tool correctables, defining a plurality of metric analysis regions distributed across the surface, and then generating one or more residual slope shape change metrics for each metric analysis region based on one or more SSCRs within each metric analysis region.Type: GrantFiled: May 21, 2012Date of Patent: May 31, 2016Assignee: KLA-Tencor CorporationInventors: Pradeep Vukkadala, Sathish Veeraraghavan, Jaydeep K. Sinha
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Patent number: 9031810Abstract: A system and method for enhanced and expanded localized geometry characterization. Objects of interest are enhanced, detected, and classified according to user-defined parameters, and this enables enhanced contrast and more accurate feature detection, as well as more accurately defined feature object regions for feature geometry measurement and characterization.Type: GrantFiled: June 27, 2011Date of Patent: May 12, 2015Inventors: Haiguang Chen, Jaydeep K. Sinha, Sergey Kamensky
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Publication number: 20130310966Abstract: A method and apparatus for process control in the processing of a substrate is disclosed in the present invention. Embodiments of the present invention utilize a first analysis tool to determine changes in a substrate's geometry. The substrate geometry data is used to generate sampling plan that will be used to check areas of the substrate that are likely to have errors after processing. The sampling plan is fed forwards to a second analysis tool that samples the substrate after it has been processed. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: ApplicationFiled: May 18, 2012Publication date: November 21, 2013Applicant: KLA-Tencor Technologies CorporationInventors: Craig W. MacNaughton, Jaydeep K. Sinha
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Publication number: 20130304399Abstract: Systems and methods for providing micro defect inspection capabilities for optical systems such as wafer metrology tools and interferometer systems are disclosed. The systems and methods in accordance with the present disclosure may detect, classify and quantify wafer surface features, wherein the detected defects are classified and the important defect metrology information of height/depth, area and volume is reported. The systems and methods in accordance with the present disclosure therefore provide more values for quantifying the negative effect of these defects on the wafer quality.Type: ApplicationFiled: May 11, 2012Publication date: November 14, 2013Applicant: KLA-Tencor CorporationInventors: Haiguang Chen, Jaydeep K. Sinha, Sergey Kamensky
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Publication number: 20130089935Abstract: The present invention may include acquiring a wafer shape value at a plurality of points of a wafer surface at a first and second process level, generating a wafer shape change value at each of the points, generating a set of slope of shape change values at each of the points, calculating a set of process tool correctables utilizing the generated set of slope of shape change values, generating a set of slope shape change residuals (SSCRs) by calculating a slope of shape change residual value at each of the points utilizing the set of process tool correctables, defining a plurality of metric analysis regions distributed across the surface, and then generating one or more residual slope shape change metrics for each metric analysis region based on one or more SSCRs within each metric analysis region.Type: ApplicationFiled: May 21, 2012Publication date: April 11, 2013Applicant: KLA-TENCOR CORPORATIONInventors: Pradeep Vukkadala, Sathish Veeraraghavan, Jaydeep K. Sinha
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Publication number: 20120179419Abstract: Disclosed herein is a system and method for enhanced and expanded localized geometry characterization. Objects of interest are classified according to user-defined parameters, and this enables enhanced contrast and more accurate feature detection, as well as more accurately defined feature object regions.Type: ApplicationFiled: June 27, 2011Publication date: July 12, 2012Inventors: Haiguang Chen, Jaydeep K. Sinha, Sergey Kamensky
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Patent number: 8065109Abstract: A system for evaluating the metrological characteristics of a surface of a substrate, the system including an optical substrate measurement system, a data analyzing system for analyzing data in an evaluation area on the substrate, applying feature-specific filters to characterize the surface of the substrate, and produce surface-specific metrics for characterizing and quantifying a feature of interest, the surface-specific metrics including a range metric for quantifying maximum and minimum deviations in the evaluation area, a deviation metric for quantifying a point deviation having a largest magnitude in a set of point deviations, where the point deviations are an amount of deviation from a reference plane fit to the evaluation area, and a root mean square metric calculated from power spectral density.Type: GrantFiled: August 28, 2009Date of Patent: November 22, 2011Assignee: KLA-Tencor CorporationInventors: Sathish Veeraraghavan, Jaydeep K. Sinha, Rabi Fettig
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Publication number: 20110144943Abstract: A system for evaluating the metrological characteristics of a surface of a substrate, the system including an optical substrate measurement system, a data analyzing system for analyzing data in an evaluation area on the substrate, applying feature-specific filters to characterize the surface of the substrate, and produce surface-specific metrics for characterizing and quantifying a feature of interest, the surface-specific metrics including a range metric for quantifying maximum and minimum deviations in the evaluation area, a deviation metric for quantifying a point deviation having a largest magnitude in a set of point deviations, where the point deviations are an amount of deviation from a reference plane fit to the evaluation area, and a root mean square metric calculated from power spectral density.Type: ApplicationFiled: August 28, 2009Publication date: June 16, 2011Applicant: KLA-TENCOR CORPORATIONInventors: Sathish Veeraraghavan, Jaydeep K. Sinha, Rabi Fettig
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Patent number: 7324917Abstract: A method and software is disclosed for evaluating characteristics, such as flatness, of a surface of a sample having an edge, comprising selecting an evaluation area having an area surface and a boundary, at least one portion of which is definable with reference to the edge, and evaluating characteristics of the area surface. Edge-specific evaluation conditions are used with edge-specific metrics to quantify parameters for said evaluation area. A system for evaluating such characteristics comprises a data collection system for generating data values for selected locations on said surface; and a data analyzing system for analyzing data values to determine such characteristics. A data interpolation system may be provided to interpolate data values collected with reference to a first coordinate system for analyzing with reference to a second coordinate system.Type: GrantFiled: July 1, 2005Date of Patent: January 29, 2008Assignee: KLA-Tencor Technologies CorporationInventors: Chris L. Koliopoulos, Jaydeep K. Sinha, Delvin A. Lindley, John F. Valley, Noel Poduje
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Patent number: 7175214Abstract: An apparatus for measuring semiconductor wafer shape that minimizes wafer distortion. The apparatus includes a plurality of wafer gripping fingers for holding a wafer in a predetermined position during wafer measurement. Each finger includes a groove that contacts the edge of the wafer. The groove and the wafer edge have respective radii of curvature, in which the radius of curvature of the groove is greater than that of the wafer edge. Each finger includes a rigid member having a recess formed in a central location at one end thereof, and a compliant material such as PEEK disposed in the recess in which the groove is formed. The compliant material extends a first distance beyond the rigid member at the central groove location and a second shorter distance beyond the rigid member on each side of the central location.Type: GrantFiled: June 24, 2004Date of Patent: February 13, 2007Assignee: ADE CorporationInventors: Jaydeep K. Sinha, Domenico Tortola, Noel S. Poduje