Patents by Inventor Jaydeep Kumar Sinha

Jaydeep Kumar Sinha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Curvature-Based Edge Bump Quantification
    Publication number: 20110112796
    Abstract: Evaluating irregularities in surfaces of objects such as semiconductor wafers using a thickness profile of a surface section and analyzing the profile to obtain information of an irregularity start position, magnitude, and span along with surface slope and height information.
    Type: Application
    Filed: November 8, 2010
    Publication date: May 12, 2011
    Applicant: KLA-TENCOR CORPORATION
    Inventors: Rabi Fettig, Jaydeep Kumar Sinha
  • Curvature-based edge bump quantification
    Patent number: 7853429
    Abstract: Evaluating irregularities in surfaces of objects such as semiconductor wafers using a thickness profile of a surface section and analyzing the profile to obtain information of an irregularity start position, magnitude, and span along with surface slope and height information.
    Type: Grant
    Filed: April 23, 2007
    Date of Patent: December 14, 2010
    Assignee: KLA-Tencor Corporation
    Inventors: Rabi Fettig, Jaydeep Kumar Sinha
  • Wafer edge-defect detection and capacitive probe therefor
    Patent number: 7629798
    Abstract: A wafer edge-defect detection system with a probe assembly having one or more capacitive plates conforming in edge shape to an edge shape of a wafer; and processing electronics for electronically driving the one or more capacitive plates and for sensing an electrical signal representing capacitance between each one or more plates and the wafer. Filtering and demodulation techniques enhance the signal to noise ratio.
    Type: Grant
    Filed: May 25, 2007
    Date of Patent: December 8, 2009
    Assignee: KLA-Tencor Corporation
    Inventors: Roy Mallory, Jaydeep Kumar Sinha, Stephen MacLeod
  • Wafer edge detection and capacitive probe therefor
    Publication number: 20080290881
    Abstract: A wafer edge detection system comprising a probe assembly having one or more capacitive plates conforming in edge shape to an edge shape of a wafer; and processing electronics for electronically driving the one or more capacitive plates and for sensing an electrical signal representing capacitance between each one or more plates and the wafer. Filtering and demodulation techniques enhance the signal to noise ratio.
    Type: Application
    Filed: May 25, 2007
    Publication date: November 27, 2008
    Inventors: Roy Mallory, Jaydeep Kumar Sinha, Stephen MacLeod
  • Curvature-based edge bump quantification
    Publication number: 20080262751
    Abstract: Evaluating irregularities in surfaces of objects such as semiconductor wafers using a thickness profile of a surface section and analyzing the profile to obtain information of an irregularity start position, magnitude, and span along with surface slope and height information.
    Type: Application
    Filed: April 23, 2007
    Publication date: October 23, 2008
    Inventors: Rabi Fettig, Jaydeep Kumar Sinha