Patents by Inventor Jaydeep P. Kulkami

Jaydeep P. Kulkami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8847633
    Abstract: Described is an integrated circuit (IC) which comprises: a first driver having stacked devices, the first driver operable on a first power supply and a first ground supply, the first driver to receive an input signal with a signal swing according to a second power supply and a second ground supply, the second power supply having a voltage level lower than a voltage level of the first power supply, and the second ground supply having a voltage level higher than a voltage level of the first ground supply; a second driver coupled to the first driver, the second driver operable on the second power supply and the second ground supply; and a pair of by-pass devices coupled to the first and second drivers, the pair of by-pass devices to provide the second power supply and the second ground supply according to an output of the first driver.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: September 30, 2014
    Assignee: Intel Corporation
    Inventors: Jaydeep P. Kulkami, Dinesh Somasekhar