Patents by Inventor Jaydip Das

Jaydip Das has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11843232
    Abstract: A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: December 12, 2023
    Inventors: Vijay Daga, Jaydip Das, Kavitha Bharadwaj, Ting Gao, Quentin Francis Polosky, Henry Paul S. Cervantes
  • Patent number: 11642077
    Abstract: Sleep tracking systems and techniques for monitoring two or more co-sleepers in a single bed are disclosed. Such systems and techniques may incorporate sleeper identification, as well as various non-user-specific aspects. Some implementations may incorporate user-specific or user-tailored alarm functionality.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: May 9, 2023
    Assignee: FITBIT, INC.
    Inventors: Juan Ignacio Correa Ramírez, Conor Joseph Heneghan, Lindsey Michelle Sunden, Lin Yang, Lukas Bielskis, Thomas Samuel Elliot, Benjamin B. Perkins, Priya Vijay Sheth, Jose Roberto Melgoza, Nicholas Adrian Myers, Chris H. Sarantos, Andrew Larsen Axley, Jaydip Das, Samuel Barry Tellman, Man-Chi Liu, Jeffrey Andrew Fisher
  • Publication number: 20230113876
    Abstract: A stator for a rotating machine with tooth segments and adjoining yoke segments, in which the tooth segments may include a higher saturation induction material and the yoke segments may include a lower saturation induction material, the stator optionally provided as a stack of single-material and multi-material lamination layers.
    Type: Application
    Filed: October 4, 2022
    Publication date: April 13, 2023
    Inventors: NATAN ARONHIME, JAYDIP DAS, MINGDA LIU, MD MEHEDI, BRANDON TROUP
  • Patent number: 11527927
    Abstract: A method of making a stator for a rotating electrical machine in which a tooth segment from a high saturation induction material and a yoke segment from a silicon steel material. The tooth segment is bond to yoke segment, thereby producing a stator with at least two magnetic saturations.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: December 13, 2022
    Assignee: CRS HOLDINGS, LLC
    Inventors: Jaydip Das, Md Mehedi, Kyle Gehret, Kyle Stritch, Tapan Shah
  • Publication number: 20220115848
    Abstract: A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.
    Type: Application
    Filed: December 20, 2021
    Publication date: April 14, 2022
    Inventors: Vijay DAGA, Jaydip DAS, Kavitha BHARADWAJ, Ting GAO, Quentin Francis POLOSKY, Henry Paul S. CERVANTES
  • Patent number: 11239639
    Abstract: A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: February 1, 2022
    Assignee: TE Connectivity Services GMBH
    Inventors: Vijay Daga, Jaydip Das, Kavitha Bharadwaj, Ting Gao, Quentin F. Polosky, Henry Paul S. Cervantes
  • Publication number: 20210142933
    Abstract: A powder including a plurality of particulates, each particulate including a soft magnetic metallic core coated with a continuous dielectric coating having a thickness selected from a range of 100 nanometers to 100 micrometers. The particulates have a mean particle size selected from a range of 100 nanometers to 250 micrometers. Methods for forming the powder are disclosed. A soft magnetic composite component includes a soft magnetic material in a dielectric matrix, wherein (i) the soft magnetic material comprises a plurality of particulates comprising metallic cores, (ii) each metallic core is coated by a continuous dielectric coating covering >90% of a surface area of the metallic core, (iii) the metallic cores are electrically isolated from each other, and (iv) the dielectric coatings of adjacent metallic cores are consolidated together. Methods for formation of the soft magnetic component by additive manufacturing and hot isostatic pressing are disclosed.
    Type: Application
    Filed: November 10, 2020
    Publication date: May 13, 2021
    Inventors: Francis William Herbert, Chins Chinnasamy, James William Sears, Christopher Phillip Allen, Jaydip Das, Nir Vaks
  • Publication number: 20200178887
    Abstract: Sleep tracking systems and techniques for monitoring two or more co-sleepers in a single bed are disclosed. Such systems and techniques may incorporate sleeper identification, as well as various non-user-specific aspects. Some implementations may incorporate user-specific or user-tailored alarm functionality.
    Type: Application
    Filed: April 28, 2017
    Publication date: June 11, 2020
    Inventors: Juan Ignacio Correa Ramírez, Conor Joseph Heneghan, Lindsey Michelle Sunden, Lin Yang, Lukas Bielskis, Thomas Samuel Elliot, Benjamin B. Perkins, Priya Vijay Sheth, Jose Roberto Melgoza, Nicholas Adrian Myers, Chris H. Sarantos, Andrew Larsen Axley, Jaydip Das, Samuel Barry Tellman, Man-Chi Liu, Jeffrey Andrew Fisher
  • Publication number: 20200161944
    Abstract: A method of making a stator for a rotating electrical machine in which a tooth segment from a high saturation induction material and a yoke segment from a silicon steel material. The tooth segment is bond to yoke segment, thereby producing a stator with at least two magnetic saturations.
    Type: Application
    Filed: November 20, 2019
    Publication date: May 21, 2020
    Inventors: Jaydip Das, Md Mehedi, Kyle Gehret, Kyle Stritch, Tapan Shah
  • Patent number: 10485149
    Abstract: A composite formulation and a composite article are provided. The composite article includes at least two layers of a composite formulation including a polymer matrix and conductive particles distributed within the polymer matrix, the conductive particles forming, by volume, between 20% and 50% of the composite formulation. The conductive particles in each of the at least two layers include at least one morphology selected from the group consisting of fibrous, dendritic, and flake, and the morphology of the conductive particles in one of the at least two layers differs from the morphology of the conductive particles in another one of the at least two layers. The composite formulation includes a polymer matrix and between 30% and 45%, by volume, tin-coated copper conductive particles at a copper/tin ratio of between 3/1 and 3/2, the conductive particles including at least two morphologies selected from the group consisting of fibrous, dendritic, and flake.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: November 19, 2019
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Megan Hoarfrost Beers, Jialing Wang, Jaydip Das, Richard B. Lloyd, James Toth, Ting Gao
  • Publication number: 20180097344
    Abstract: A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.
    Type: Application
    Filed: September 30, 2016
    Publication date: April 5, 2018
    Inventors: Vijay Daga, Jaydip Das, Kavitha Bharadwaj, Ting Gao, Quentin F. Polosky, Henry Paul S. Cervantes
  • Publication number: 20180086924
    Abstract: A method of forming a composite article, wherein the method includes providing a composite formulation, the composite formulation including a polymer matrix and at least one additive distributed in the polymer matrix at a concentration of between 10% and 50%, by volume, the at least one additive having a molar percentage of carbon that is equal to or less than 90%, feeding the composite formulation to a printing head of an additive manufacturing device, heating the composite formulation to form a heated composite formulation, extruding the heated composite formulation through a nozzle in the printing head, and depositing the heated composite formulation onto a platform to form the composite article. Also provided is a composite article produced from a composite formulation having at least one additive distributed in a polymer matrix.
    Type: Application
    Filed: September 23, 2016
    Publication date: March 29, 2018
    Inventors: Megan Hoarfrost Beers, Jialing Wang, Quentin F. Polosky, Jaydip Das, Ting Gao, Vishrut Vipul Mehta
  • Publication number: 20180092258
    Abstract: A composite formulation and a composite article are provided. The composite article includes at least two layers of a composite formulation including a polymer matrix and conductive particles distributed within the polymer matrix, the conductive particles forming, by volume, between 20% and 50% of the composite formulation. The conductive particles in each of the at least two layers include at least one morphology selected from the group consisting of fibrous, dendritic, and flake, and the morphology of the conductive particles in one of the at least two layers differs from the morphology of the conductive particles in another one of the at least two layers. The composite formulation includes a polymer matrix and between 30% and 45%, by volume, tin-coated copper conductive particles at a copper/tin ratio of between 3/1 and 3/2, the conductive particles including at least two morphologies selected from the group consisting of fibrous, dendritic, and flake.
    Type: Application
    Filed: September 23, 2016
    Publication date: March 29, 2018
    Inventors: Megan Hoarfrost Beers, Jialing Wang, Jaydip Das, Richard B. Lloyd, James Toth, Ting Gao
  • Publication number: 20170145170
    Abstract: A composite formulation and composite product are disclosed. The composite formulation includes a polymer matrix having metal particles, the metal particles including dendritic particles and tin-containing particles. The metal particles are blended within the polymer matrix at a temperature greater than the melt temperature of the polymer matrix. The tin containing particles are at a concentration in the composite formulation of, by volume, between 10% and 36%, and the dendritic particles are at a concentration in the composite formulation of, by volume, between 16% and 40%. The temperature at which the metal particles are blended generates metal-metal diffusion of the metal particles, producing intermetallic phases, the temperature being at least the intermetallic annealing temperature of the metal particles.
    Type: Application
    Filed: February 6, 2017
    Publication date: May 25, 2017
    Applicant: TE Connectivity Corporation
    Inventors: Jaydip Das, Ting Gao, Mark F. Wartenberg, Kavitha Bharadwaj, Richard B. Lloyd, Rodney Ivan Martens
  • Patent number: 9646746
    Abstract: An electrical device having first and second electrodes and a layer of a conductive composite electrically in contact with the first and second electrodes. The conductive composite is a mixture of a semi-crystalline polymer and a conductive filler, the conductive filler including a plurality of particles containing an inner material including a first metal; and an outer material surrounding the inner material, the outer material including a second metal; and an intermetallic compound formed between the inner material and the outer material. The intermetallic compound has features from the inner material and the outer material. The device can be a circuit protection device. Also provided is a method of making a conductive composite by dry mixing the components.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: May 9, 2017
    Assignee: ITTELFUSE, INC.
    Inventors: Jaydip Das, Ting Gao, Nicola Pugliano, Mark F. Wartenberg, Diane G. Bigler, Mario G. Sepulveda, Kavitha Bharadwaj, Richard B. Lloyd
  • Publication number: 20170004946
    Abstract: Conductive composite compositions and circuit protection devices including a conductive composite composition are disclosed. The conductive composite composition includes a polymer material, a plurality of conductive particles, and a high melting point additive. The high melting point additive comprises at least 1% of the conductive composite, by volume of the total composition. The circuit protection device includes a body portion comprising a conductive composite composition, the conductive composite composition comprising a polymer material, a plurality of conductive particles, and at least 1%, by volume, of a high melting point additive loaded in the polymer material, and leads extending from the body portion, the leads arranged and disposed to electrically couple the circuit protection device to an electrical system. Also provided is a method of forming a conductive composite.
    Type: Application
    Filed: June 30, 2015
    Publication date: January 5, 2017
    Applicant: Tyco Electronics Corporation
    Inventors: Edward W. Rutter, JR., Ann O. Banich, Jaydip Das, Chun-Kwan Tsang, Kavitha Bharadwaj, Ting Gao, Jianhua Chen, James Toth
  • Publication number: 20160302334
    Abstract: Cable shielding assemblies and processes of producing cable shielding assemblies are described. The cable shielding assemblies include a conductor and a conductive composite shield extending around at least a portion of the conductor, the conductive composite shield having a non-conductive matrix and conductive particles within the non-conductive matrix. The conductive composite shield has a resistivity of less than 0.05 ohm·cm. The processes of producing cable shielding assembles include positioning the conductive composite shield. The positioning is at least partially around a conductor, at least partially around a dielectric material, at least partially surrounded by a jacket material, or a combination thereof.
    Type: Application
    Filed: April 10, 2015
    Publication date: October 13, 2016
    Applicant: Tyco Electronics Corporation
    Inventors: Jialing Wang, Richard B. Lloyd, Ting Gao, Jaydip Das
  • Publication number: 20160042845
    Abstract: An electrical device having first and second electrodes and a layer of a conductive composite electrically in contact with the first and second electrodes. The conductive composite is a mixture of a semi-crystalline polymer and a conductive filler, the conductive filler including a plurality of particles containing an inner material including a first metal; and an outer material surrounding the inner material, the outer material including a second metal; and an intermetallic compound formed between the inner material and the outer material. The intermetallic compound has features from the inner material and the outer material. The device can be a circuit protection device. Also provided is a method of making a conductive composite by dry mixing the components.
    Type: Application
    Filed: July 10, 2015
    Publication date: February 11, 2016
    Applicant: Tyco Electronics Corporation
    Inventors: Jaydip Das, Ting Gao, Nicola Pugliano, Mark F. Wartenberg, Diane G. Bigler, Mario G. Sepulveda, Kavitha Bharadwaj, Richard B. Lloyd
  • Publication number: 20160012933
    Abstract: A composite formulation and composite product are disclosed. The composite formulation includes a polymer matrix, tin-containing particles blended within the polymer matrix at a concentration, by weight, of at least 25%, copper-containing particles blended within the polymer matrix at a concentration, by weight, of at least 40%, and one or both of solder flux and density-lowering particles blended into the polymer matrix. The tin-containing particles and the copper-containing particles have one or more intermetallic phases from metal-metal diffusion of the tin-containing particles and the copper-containing particles being blended at a temperature within the intermetallic annealing temperature range for the tin-containing particles and the copper-containing particles.
    Type: Application
    Filed: July 11, 2014
    Publication date: January 14, 2016
    Applicant: Tyco Electronics Corporation
    Inventors: Jaydip Das, Ting Gao, Jialing Wang, Nicola Pugliano, Kavitha Bharadwaj, Richard B. Lloyd
  • Publication number: 20160012934
    Abstract: A composite formulation and composite product are disclosed. The composite formulation includes a polymer matrix having metal particles, the metal particles including dendritic particles and tin-containing particles. The metal particles are blended within the polymer matrix at a temperature greater than the melt temperature of the polymer matrix. The tin containing particles are at a concentration in the composite formulation of, by volume, between 10% and 36%, and the dendritic particles are at a concentration in the composite formulation of, by volume, between 16% and 40%. The temperature at which the metal particles are blended generates metal-metal diffusion of the metal particles, producing intermetallic phases, the temperature being at least the intermetallic annealing temperature of the metal particles.
    Type: Application
    Filed: July 11, 2014
    Publication date: January 14, 2016
    Applicant: Tyco Electronics Corporation
    Inventors: Jaydip Das, Ting Gao, Mark F. Wartenberg, Kavitha Bharadwaj, Richard B. Lloyd, Rodney Ivan Martens