Patents by Inventor Jaydutt J. Joshi

Jaydutt J. Joshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip packages with improved thermal performance
    Patent number: 9006889
    Abstract: Systems and methods for improving thermal performance, such as thermal dissipation, of flip chip packages that include one or more flip chip dies are disclosed. In some embodiments, a thermal collection layer can be formed on a surface of a flip chip die. The thermal collection layer can be configured to dissipate heat generated by the flip chip die. In some variations, the thermal collection layer can be constructed using materials having high thermal conductivity.
    Type: Grant
    Filed: November 12, 2012
    Date of Patent: April 14, 2015
    Assignee: Skyworks Solutions, Inc.
    Inventor: Jaydutt J. Joshi