Patents by Inventor Jayesh P. Shah

Jayesh P. Shah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240117225
    Abstract: The present invention relates to a contact adhesive composition based on chloroprene rubber, to a preparation method of the contact adhesive composition and to a method of bonding substrate by using the contact adhesive composition. In particular, the present invention relates to a contact adhesive composition comprising a fast-crystallizing chloroprene rubber and a slowly-crystallizing chloroprene rubber.
    Type: Application
    Filed: February 18, 2022
    Publication date: April 11, 2024
    Inventors: Krunal Trivedi, Mihirkumar Patel, Jayesh P. Shah, Nippon Ghosh
  • Publication number: 20240117203
    Abstract: The present invention relates to a water absorbing, electrically conductive composition comprising a) a water soluble and/or water swellable and/or water absorbing resin; b) an electrically conductive filler; and c) a solvent. The water absorbing, electrically conductive composition according to according to the present invention can be used as a sensor for erosion and/or corrosion monitoring.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Inventors: Dipak Tathe, Jayesh P. Shah
  • Publication number: 20230312414
    Abstract: The present invention is directed to a two-component (2K) anhydrous composition comprising a first component (1) comprising calcium aluminate cement; Ground Granulated Blast Furnace Slag (GGBS); and fumed silica; and a second component (2) comprising calcined bauxite; and fused zirconia mullite.
    Type: Application
    Filed: June 7, 2023
    Publication date: October 5, 2023
    Inventors: Sangita Singh, Jayesh P. Shah, Paresh Vallabhbhai Raiyani
  • Publication number: 20220332990
    Abstract: The present invention provides a two-component (2K) curable composition comprising: (A) a first component comprising: i) at least one cyanoacrylate monomer represented by Formula 1: H2C?C(CN)—COOR??(1) wherein: R is selected from C1-C18 alkyl, C3-C18 cycloalkyl, C2-C15 alkenyl, C6-C18 aryl, C7-C15 aralkyl and C3-C15 allyl; and, ii) peroxide catalyst; and, iii) at least one cure accelerator for said at least one cyanoacrylate monomer i); (B) a second component comprising: i) at least one free radically curable compound; and, ii) at least one transition metal compound, wherein, when said components are mixed together the peroxide catalyst initiates cure of said free radically curable compound(s) and the transition metal compound(s) initiates cure of the cyanoacrylate monomer(s), and further wherein said at least one free radically curable compound comprises at least one unsaturated polyester polymer containing at least two cycloolefinic double bonds.
    Type: Application
    Filed: May 18, 2022
    Publication date: October 20, 2022
    Inventors: Nishant Tale, Krunal Trivedi, Jayesh P. Shah
  • Publication number: 20220275259
    Abstract: The present invention provides an one-component (1K) anaerobic curable composition comprising, based on the weight of the composition: from 15 to 35 wt. % of a1) at least one (meth)acrylate monomer represented by Formula I: H2C?CGCO2R1 ??(I) wherein: G is hydrogen, halogen or a C1-C4 alkyl group; and, R1 is selected from C1-C30 alkyl, C3-C30 cycloalkyl, C2-C20 alkenyl and C2-C12 alkynyl; from 5 to 25 wt. % of a2) at least one (meth)acrylate monomer represented by Formula II: H2C?CQCO2R2 ??(II) wherein: Q may be hydrogen, halogen or a C1-C4 alkyl group; and, R2 may be selected from C6-C18 aryl, alkaryl and aralkyl; from 35 to 75 wt. % of a3) at least one (meth)acrylate-functionalized oligomer; from 0.1 to 10 wt. % of b) at least one cure initiator; from 0.1 to 5 wt. % of c) at least one cure accelerator; from 1 to 5 wt. % of d) at least one cellulose mixed ester of which all of said ester groups are selected from C1-C6 ester groups; and, from 1 to 5 wt. % of e) fumed silica.
    Type: Application
    Filed: May 18, 2022
    Publication date: September 1, 2022
    Inventors: Krunal Trivedi, Namdev Ghule, Jayesh P. Shah, Prasad Khandagale
  • Publication number: 20220213272
    Abstract: The present invention is directed to a one-component (1K) moisture curable composition comprising: (a) at least one polyorganosiloxane which has at least one alkoxy group bound to a silicon atom, (b) at least one alkoxy-containing aminofunctional silicone resin, (c) at least one adhesion promoter different from said alkoxy-containing aminofunctional silicone resin (b), and (d) at least one curing catalyst. The invention also relates to coatings, sealants, or adhesives comprising said composition, cured products obtained from said composition, use of the composition.
    Type: Application
    Filed: March 24, 2022
    Publication date: July 7, 2022
    Inventors: Mihirkumar Patel, Nivedita Nandanwar, Jayesh P. Shah
  • Publication number: 20220127449
    Abstract: The present invention is directed to a two component (2K) composition comprising: (A) a first component comprising: a) at least one epoxy resin different from said resin b); and, b) at least one elastomer modified epoxy resin; (B) a second component comprising: c) a curative which consists of at least one compound possessing at least two epoxide reactive groups per molecule, said curative being characterized by comprising at least one alkoxy-containing aminofunctional silicone resin, wherein said composition is characterized in that it is free of catalysts.
    Type: Application
    Filed: January 4, 2022
    Publication date: April 28, 2022
    Inventors: Mihirkumar Patel, Satyanarayana Raju Kutcherlapati, Jayesh P. Shah, Dipak Tathe
  • Publication number: 20220081591
    Abstract: The present invention relates to two-part cyanoacrylate adhesive comprising a) a first part comprising a cyanoacrylate component; a peroxide catalyst; a stabilizer and a thickener; and b) a second part comprising a (meth)acrylate component; a graphene oxide; an adhesion promoter; a metal salt; and a fumed silica. Adhesive according to the present invention provides good performance as structural adhesive, good adhesion strength, good open and fix times, good tensile lap shear strength and good peel strength.
    Type: Application
    Filed: November 30, 2021
    Publication date: March 17, 2022
    Inventors: Krunal Trivedi, Nishant Tale, Jayesh P. Shah
  • Publication number: 20210171686
    Abstract: Two-part cyanoacrylate/cationically curable adhesive systems are provided.
    Type: Application
    Filed: January 26, 2021
    Publication date: June 10, 2021
    Inventors: Jayesh P Shah, Sangita Singh, Nishant Tale, Krunal Trivedi
  • Publication number: 20210147597
    Abstract: Two-part cyanoacrylate/cationically curable adhesive systems are provided.
    Type: Application
    Filed: January 25, 2021
    Publication date: May 20, 2021
    Inventors: Aine Mooney, Jayesh P. Shah, Dipak Tathe
  • Patent number: 10125050
    Abstract: A wear resistant substrate including a metal substrate having a surface, a reinforcing support attached to the surface and cured reaction products of an inorganic curable composition disposed over and through the reinforcing support and bonded to the surface. Also a method of enhancing the wear resistance of a metal surface by attaching a reinforcing support to the surface; disposing an inorganic curable composition over and through the reinforcing support and into contact with the surface; and curing the composition.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: November 13, 2018
    Assignees: Henkel IP & Holding GmbH, Henkel AG & Co. KGaA
    Inventors: Jayesh P. Shah, Kedar Deshmukh, Nippon Ghosh
  • Publication number: 20160168034
    Abstract: A wear resistant substrate including a metal substrate having a surface, a reinforcing support attached to the surface and cured reaction products of an inorganic curable composition disposed over and through the reinforcing support and bonded to the surface. Also a method of enhancing the wear resistance of a metal surface by attaching a reinforcing support to the surface; disposing an inorganic curable composition over and through the reinforcing support and into contact with the surface; and curing the composition.
    Type: Application
    Filed: February 3, 2016
    Publication date: June 16, 2016
    Inventors: Jayesh P. Shah, Kedar Deshmukh, Nippon Ghosh
  • Publication number: 20150151522
    Abstract: Disclosed is a composite laminate made from unsaturated polyester resin that can be bonded using polyurethane adhesive without secondary treatment of the composite laminate and with improved bond strength and failure mode. Also disclosed are methods of making such composite laminates.
    Type: Application
    Filed: February 10, 2015
    Publication date: June 4, 2015
    Inventors: Jayesh P. Shah, Sankar Govindarajan
  • Publication number: 20080292801
    Abstract: The present invention concerns adhesive compositions that provide corrosion-preventative properties and improved adhesive bonding on corrodible surfaces, such as may be found in electronic components. These compositions provide the substrates with greatly increased resistance to corrosion, especially during long term exposure to high temperatures and/or high humidity. When used on conductive substrates, the compositions also maintain good initial and ongoing electrical conductivity.
    Type: Application
    Filed: May 23, 2007
    Publication date: November 27, 2008
    Applicant: National Starch and Chemical Investment Holding Corporation
    Inventors: Jayesh P. Shah, Bo Xia, Chih-Min Cheng
  • Patent number: 7056978
    Abstract: A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride, a core shell polymer and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.
    Type: Grant
    Filed: November 6, 2002
    Date of Patent: June 6, 2006
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventor: Jayesh P. Shah
  • Publication number: 20040087681
    Abstract: A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride, a core shell polymer and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.
    Type: Application
    Filed: November 6, 2002
    Publication date: May 6, 2004
    Inventor: Jayesh P. Shah