Abstract: A method for forming a multilayer substrate from two or more constituent substrates and an interface material. Electrically conductive or nonconductive features may be formed into the interface material and registered to electrically conductive or nonconductive features at the surface of at least one of the constituent substrates. Thereby, electrical communication may be provided between conductive features of the constituent substrates and the interface material.

Abstract: The invention provides an optical connection between a component on a printed circuit board (“PCB”) and an optical fiber embedded in the PCB. By optically connecting the component with the optical fiber, the component may use the optical fiber for high speed optical data communication.

Abstract: A method, apparatus, and system for a printed circuit board (PCB) and package with an embedded air dielectric includes a conductor formed on a surface of a first core layer, a conductor layer overlaying an inner surface of a cavity formed in a second core layer, the conductor layer opposing the conductor, and a sealed air channel between and separating the conductor and the conductor layer from contacting each other. A gas in the sealed air channel provides a primary dielectric therein. The gas may be air.

Abstract: A compressible domed contact used as a portion of socket contact within an electrical socket to eliminate co-planarity issues and to achieve an effective electrical connection between the electrical socket and a microelectronic device. The compressible domed contact may be made of resilient material such that it will substantially return to its original shape after being compressed.

Abstract: A compressible domed contact used as a portion of socket contact within an electrical socket to eliminate co-planarity issues and to achieve an effective electrical connection between the electrical socket and a microelectronic device. The compressible domed contact may be made of resilient material such that it will substantially return to its original shape after being compressed.

Abstract: Methods for forming electrical connections between two components, as well as various embodiments of devices created according to the disclosed methods, are described. The method includes forming a depression in a land disposed on a first component, wherein the depression is shaped to receive a conductive bump extending from a second component. A layer of conductive material is disposed between the land and the conductive bump, and the conductive material layer is used to form an electrical connection between the land and conductive bump.

Abstract: The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.

Abstract: The invention provides an optical connection between a component on a printed circuit board (“PCB”) and an optical fiber embedded in the PCB. By optically connecting the component with the optical fiber, the component may use the optical fiber for high speed optical data communication.

Abstract: The invention provides a printed circuit board (“PCB”) with embedded optical fibers. In one embodiment, the optical fibers are in a pattern between layers of the PCB. In another embodiment, the optical fibers are within a layer of the PCB. Optical fibers embedded within the PCB allows components to use high speed optical data communication.