Patents by Inventor Jayprakash Thakur

Jayprakash Thakur has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220132654
    Abstract: A wave launcher may include a printed circuit board (PCB) that includes a pin that receives a radio frequency (RF) signal. The wave launcher may include a cylinder configured to be electrically coupled to the pin and define an opening. The cylinder may receive the RF signal from the pin, form a transition from coplanar to Goubau line structure with a plate, and generate the surface wave. The wave launcher may include an insulator configured to be physically positioned within the opening and between the cylinder and a power line. The insulator may mechanically isolate the cylinder from the power line and permit the cylinder to launch the surface wave on the power line. The wave launcher may include the plate electrically coupled to a pad and may provide a reference for the pin and the cylinder. The pin and the cylinder may be physically positioned proximate the plate.
    Type: Application
    Filed: June 22, 2021
    Publication date: April 28, 2022
    Inventors: Vishram Shriram PANDIT, Neel Harkishin BHATIA, Rajiv PANIGRAHI, Ramaswamy PARTHASARATHY, Satish RAMACHANDRA, Ajay SHARMA, Manish SHARMA, Vaibhavdeep SINGH, Ravichandra TUNGANI CHIKKABASAVAIAH, Jayprakash THAKUR
  • Patent number: 11139553
    Abstract: Technologies for a metal chassis for an electronic device are disclosed. A manufacturer may manufacture a chassis of an electronic device by machining a recess into a chassis preform and perform an anodization of the chassis. The manufacturer may machine the side of the chassis preform opposite the recess to a predefined thickness, and then perform a subsequent anodization. The predefined thickness is selected so that, after the subsequent anodization, there is a single anodized layer between the surface of the recess and the chassis surface on the opposite side. The single anodized layer is non-conductive, allowing electromagnetic signals of an antenna to pass through.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: October 5, 2021
    Assignee: Intel Corporation
    Inventors: Jayprakash Thakur, Prakash Kurma Raju, Prasanna Pichumani, Akarsha Kadadevaramath
  • Publication number: 20210203053
    Abstract: A communication system communicates data elements on a conducting wire. In an embodiment, a sequence of data elements to be transmitted is electrically represented on a pair of terminals, and a transmission element located at a first portion of the conducting wire transmits the sequence in the form of a wave on a surface of the conducting wire. The transmission element includes a first conductor wrapped around the first portion of the conducting wire, a first insulator located between the first conductor and the first portion of the conducting wire, and a conductive structure disposed around the first conductor. The conductive structure has a narrow cross section at one end and extends outwardly to a broader cross section at the other end. A first terminal of the pair of terminals is electrically connected to the first conductor and the second terminal is electrically connected to the conductive structure.
    Type: Application
    Filed: September 24, 2020
    Publication date: July 1, 2021
    Inventors: Ramaswamy Parthasarathy, Punit Ashok Rathod, Jayprakash Thakur, Arvind Sundaram, Ajay Sharma, Nikita Bipin Ambasana, Satish Ramachandra, Vishram Shriram Pandit
  • Publication number: 20210111481
    Abstract: Various embodiments utilize part of an existing antenna pattern in a computing device to implement a specific absorption rate (SAR) sensor element using a radio frequency (RF) filter circuit. The integrated solutions of the present disclosure help to eliminate the external SAR sensor pad requirement and further help to improve wireless performance. The embodiments of the present disclosure may be implemented with a variety of different types of antenna (e.g., slot, metal ring/aperture, PCB, etc.). Other embodiments may be described and claimed.
    Type: Application
    Filed: December 21, 2020
    Publication date: April 15, 2021
    Inventors: Jayprakash Thakur, Maruti Tamrakar, Sagar Gupta, Prasanna Pichumani, Sudheera Sudhakar
  • Publication number: 20210111486
    Abstract: Various embodiments provide an antenna assembly and associated systems, devices, and methods. The antenna assembly may include two or more antennas, including a first antenna and a second antenna, coupled to a ground plane. The antenna assembly may further include an isolation network coupled to the ground plane between the first and second antennas. The isolation network may include a conductive structure between conductive antenna portions of the first and second antennas, and an isolation circuit coupled between the conductive structure and the ground plane. The isolation circuit may include a resistor, an inductor, and/or a capacitor (e.g., coupled in parallel with one another). Other embodiments may be described and claimed.
    Type: Application
    Filed: December 21, 2020
    Publication date: April 15, 2021
    Inventors: Maruti Tamrakar, Sagar Gupta, Jayprakash Thakur, Rakhi Singh
  • Publication number: 20200127384
    Abstract: Example slot antennas for electronic user device and related methods are disclosed herein. An example electronic user device including at least one of a lid or a base. The at least one of the lid or the base have a first surface and a second surface spaced apart from the second surface. The example electronic user device includes an antenna including a first aperture in the first surface and a second aperture in the second surface. The example user device includes a first cover at least partially disposed in the first aperture and a second cover at least partially disposed in the second aperture.
    Type: Application
    Filed: December 17, 2019
    Publication date: April 23, 2020
    Inventors: Jayprakash Thakur, Prakash Kurma Raju, Gustavo Fricke
  • Publication number: 20200091608
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Application
    Filed: December 20, 2017
    Publication date: March 19, 2020
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • Patent number: 10389021
    Abstract: An antenna isolation circuit configured to provide an isolation between two adjacent antennas in a wireless communication device is disclosed. The antenna isolation circuit comprises a partition line circuit comprising a conductive element configured to be placed between the two adjacent antennas; and a matching circuit having a first end and a second end. In some embodiments, the matching circuit is coupled to the partition line circuit at the first end and to a ground circuit at the second end. In some embodiments, the matching circuit is configured to provide an impedance. In some embodiments, a dimension of the conductive element and the impedance of the matching circuit are configured to result in an isolation between the two adjacent antennas.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: August 20, 2019
    Assignee: Intel Corporation
    Inventor: Jayprakash Thakur
  • Publication number: 20190252770
    Abstract: An antenna isolation circuit configured to provide an isolation between two adjacent antennas in a wireless communication device is disclosed. The antenna isolation circuit comprises a partition line circuit comprising a conductive element configured to be placed between the two adjacent antennas; and a matching circuit having a first end and a second end. In some embodiments, the matching circuit is coupled to the partition line circuit at the first end and to a ground circuit at the second end. In some embodiments, the matching circuit is configured to provide an impedance. In some embodiments, a dimension of the conductive element and the impedance of the matching circuit are configured to result in an isolation between the two adjacent antennas.
    Type: Application
    Filed: February 15, 2018
    Publication date: August 15, 2019
    Inventor: Jayprakash Thakur
  • Publication number: 20190131692
    Abstract: Technologies for a metal chassis for an electronic device are disclosed. A manufacturer may manufacture a chassis of an electronic device by machining a recess into a chassis preform and perform an anodization of the chassis. The manufacturer may machine the side of the chassis preform opposite the recess to a predefined thickness, and then perform a subsequent anodization. The predefined thickness is selected so that, after the subsequent anodization, there is a single anodized layer between the surface of the recess and the chassis surface on the opposite side. The single anodized layer is non-conductive, allowing electromagnetic signals of an antenna to pass through.
    Type: Application
    Filed: December 27, 2018
    Publication date: May 2, 2019
    Inventors: Jayprakash Thakur, Prakash Kurma Raju, Prasanna Pichumani, Akarsha Kadadevaramath
  • Publication number: 20160380356
    Abstract: An antenna having a radiator, a ground plane, and a stub configured to couple the radiator to the ground plane. The radiator may have nested radiators. The antenna covers frequency bands in a range of approximately 680 MHz to approximately 20 GHz. Lower and higher operational frequencies of the antenna may be varied by adjusting the physical parameters of the antenna, such as length and width of the radiator, gaps between the nested radiators, number of nested radiators, ground plane size, and stub size.
    Type: Application
    Filed: May 17, 2016
    Publication date: December 29, 2016
    Inventors: Jayprakash Thakur, Praveen Kumar