Abstract: A stacked structure of integrated circuits includes a substrate, a frame layer, an upper integrated circuit, a plurality of first wires, a plurality of spacer elements, a lower integrated circuit, a plurality of second wires, and a compound. The substrate has a first surface and a second surface on which a plurality of first electrodes are formed. The frame layer has an upper surface on which a plurality of second electrodes and third electrodes are formed and a lower surface, the lower surface of the frame layer is adhered to the first surface of the substrate. The lower integrated circuit is adhered onto the first surface of the substrate, a plurality of bonding pads are formed on the lower integrated circuit. The plurality of first wires are electrically connected the second electrodes of the frame layer to the bonding pads of the lower integrated circuit. The plural spacer elements are arranged on the lower integrated circuit.