Abstract: A capacitor has at least two layers of substantially parallel interdigitated strips. The strips of each layer are alternately connected to a first and a second bus. The first and second buses of each layer are interconnected to first and second buses of an adjacent layer. The strips of each layer are approximately perpendicular to strips of an adjacent layer. The capacitor further includes dielectric material between strips of the same and different layers. A method of fabricating the capacitor includes forming at least two layers of substantially parallel interdigitated strips which are alternately connected to first and second buses of each layer. The buses of each layer are connected to the respective buses of an adjacent layer. The strips of one layer are approximately perpendicular to the strips of an adjacent layer. Dielectric material is formed between strips of the same and different layers.

Abstract: The present invention provides a capacitor structure for an integrated circuit comprising at least two layers of substantially parallel interdigitated strips wherein the strips of each layer are alternately connected to a first bus and a second bus. The first and the second bus of each layer are respectively interconnected to the first and second bus of an adjacent layer. The strips of each layer are oriented approximately perpendicular to the strips of an adjacent layer. The capacitor structure further comprises dielectric material between strips of the same and different layers.