Abstract: A printed circuit board having an embedded cavity capacitor is disclosed. According to an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor, the printed circuit board can include two conductive layers to be used as a power layer and a ground layer, respectively; and a first dielectric layer, placed between the two conductive layers, wherein at least one cavity capacitor is arranged in a noise-transferable path between a noise source and a noise prevented destination which are placed on the printed circuit board, the cavity capacitor being formed to allow a second dielectric layer to have a lower stepped region than the first dielectric layer, the second dielectric layer using the two conductive layers as a first electrode and a second electrode, respectively, and placed between the first electrode and the second electrode.

Abstract: A multi-layer printed circuit board and a method of manufacturing the multi-layer printed circuit board using a metal substrate as a core member and having an electronic component embedded in the metal substrate, the method including anodizing the metal substrate such that an anodic oxide layer is formed on upper and lower sides of the metal substrate, respectively; forming an inner layer circuit on upper and lower anodic oxide layers, respectively; etching the metal substrate to form a cavity in correspondence with a position where the electronic component is to be embedded; mounting the electronic component in the cavity with a chip bond adhesive; and forming an outer layer circuit on upper and lower sides of the metal substrate, respectively, such that a multi-layer circuit is formed.

Abstract: A method of manufacturing a circuit board is disclosed. A method of manufacturing a circuit board that includes forming a first circuit pattern on the insulation layer of a carrier, in which an insulation layer and a first seed layer are stacked in order; stacking and pressing the carrier and an insulation board with the side of the carrier having the first circuit pattern facing the insulation board; removing the carrier to transfer the first circuit pattern and the insulation layer onto the insulation board; and forming a second circuit pattern on the insulation layer transferred to the insulation board, allows fine pitch circuit patterns to enable the manufacture of fine circuit patterns of high density on the board, and allows the manufacture of a multi-layer circuit board with a simple process.

Abstract: A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting layer formed in the cavity in contact with the first insulation layer, a first component mounted on the mounting layer, and a second insulation layer covering at least a portion of the heat-release layer and the cavity, may offer improved heat release and smaller thickness.

Abstract: An optical wiring board having a core, the optical wiring board including: a lower cladding; a side cladding formed over the lower cladding and having an indentation formed therein, the indentation being in correspondence with the core; a core embedded in the indentation; and an upper cladding covering the core, wherein a height of the core is different from a depth of the indentation

Abstract: A component-embedded PCB and a method of manufacturing the PCB are disclosed. Using a method that includes perforating a cavity in a core substrate; inserting a component in the cavity; stacking a film layer over the core substrate; forming at least one post by selectively leaving behind the film layer in correspondence to a position of at least one electrode of the component; covering an insulation layer over the core substrate such that the post penetrates the insulation layer to be exposed at a surface of the insulation layer; and forming at least one via hole by removing the post, can provide increased precision and finer pitch. Also, since laser is not used when processing the vias, damage to the component that may occur due to the laser is prevented. Furthermore, tolerance defects may be decreased, as well as defects caused by residue left after processing.

Abstract: A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide.

Abstract: A manufacturing method of bottom substrate of package. A bottom substrate of a package on package electrically connected to a top substrate by means of a solder ball, including a core board, a solder ball pad formed on a surface of the core board in correspondence with a location of the solder ball, an insulation layer laminated on the core board, a through hole formed by removing a part of the insulation layer such that the solder ball pad is exposed, and a metallic layer filled in the through hole and connected electrically with the solder ball, allows the number of ICs mounted on a bottom substrate to be increased without increasing the size of a solder ball, and allows the size and pitch of the solder balls to be made smaller by controlling the thickness of the insulation layer laminated on the bottom substrate, whereby more signal transmission is possible between a top substrate and a bottom substrate.

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include: an optical waveguide, in one side of which a circuit pattern and a pad are buried; an insulation layer stacked over one side of the optical waveguide; a first insulating material stacked over the insulation layer; a first electrical wiring layer stacked over the first insulating material; a second insulating material stacked over the other side of the optical waveguide; a second electrical wiring layer stacked over the second insulating material; and a via penetrating the optical waveguide. Certain embodiments of the invention enable the efficient transmission of optical and electrical signals, reduce loss in the optical signals transferred to the photoelectric converters, and allow more efficient designs for the wiring in the board.

Abstract: Disclosed herein is a circuit layer including CNTs including an electroless copper plating layer formed on an insulating layer, and a CNT layer deposited on the electroless copper plating layer, thus the circuit layer has excellent electrical properties.

Abstract: An EMI noise reduction board using an electromagnetic bandgap structure is disclosed. In the EMI noise reduction board according to an embodiment of the present invention, an electromagnetic bandgap structure having band stop frequency properties can be inserted into an inner portion of the board so as to shield an EMI noise, in which the portion corresponds to an edge of the board and in which the EMI noise is conducted from the inside to the edge of the board and radiates to the outside of the board.

Abstract: The invention relates to a printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The invention makes the printed circuit board slim, and increases reliability and the degree of design freedom.

Abstract: Disclosed is a package substrate including a solder resist layer having pattern parts and a method of fabricating the same, in which the pattern parts are formed on the solder resist layer, thus increasing heat dissipation efficiency and minimizing the warpage of the substrate.

Abstract: Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.

Abstract: A method of manufacturing a printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.

Abstract: A printed circuit board including an optical waveguide and a method of manufacturing the board. In the board, the optical waveguide includes a metal layer extending portion integrally connected to a metal layer constituting a mirror formed in the optical waveguide. Since the method creates the mirror using electroless plating, which is typically used in a process of manufacturing general printed circuit boards, it is suitable for the manufacture of printed circuit boards having a large area, and the mirror has high reflectivity and is efficient in terms of material consumption.

Abstract: A method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.

Abstract: The printed circuit board is manufactured using a simple process of forming a bump on a first metal layer using fireable paste containing carbon nanotubes, firing the first metal layer including the bump, forming an insulating layer and a second metal layer on the first metal layer, and patterning the first and second metal layers, thus specific resistance of the resulting printed circuit board is decreased, and electrical conductivity and cooling performance are improved.

Abstract: Disclosed is a printed circuit board including bumps formed using a conductive paste including carbon nanotubes and a photosensitive binder. A method of manufacturing the printed circuit board is also provided. The printed circuit board includes bumps formed using the conductive paste having carbon nanotubes, and can realize good electrical connection with electronic parts mounted thereon. The bumps can be formed at a fine pitch, thus realizing a circuit layer having a high density.

Abstract: Disclosed herein is a printed circuit board including a landless via and a method of manufacturing the printed circuit board. The printed circuit board includes a landless via having no upper land. The via includes a circuit pattern having a line width smaller than the minimum diameter of the via. The via does not have an upper land on an end surface thereof having the minimum diameter, and thus a circuit pattern connected to the via is finely formed, resulting in the high-density circuit pattern. Thus, a compact printed circuit board having a reduced number of layers is realized.