Abstract: A method for fabricating a ceramic substrate includes: preparing a ceramic substrate; disposing a metal mask having a plurality of holes at an upper side of the ceramic substrate; and injecting a polyimide resin into the holes of the metal mask to form a polyimide thin film on the ceramic substrate. A thin film is formed on a ceramic substrate in a simpler manner, so the fabrication cost can be reduced and a fixed time can be shortened, thus increasing the efficiency of a product.

Abstract: The present invention provides a ceramic substrate including: a ceramic stacked layer structure in which multiple ceramic layers are stacked to be interconnected through a via provided within each of the ceramic layers, the ceramic stacked layer structure having a hole provided therein to expose a top portion of the via provided within a ceramic layer of being a surface layer; a conductive material filled within the hole; and an external electrode formed on the surface of the ceramic stacked layer structure so that the external electrode is electrically connected to the conductive material, and a manufacturing method thereof.

Abstract: A method for fabricating a ceramic substrate includes: preparing a ceramic substrate; disposing a metal mask having a plurality of holes at an upper side of the ceramic substrate; and injecting a polyimide resin into the holes of the metal mask to form a polyimide thin film on the ceramic substrate. A thin film is formed on a ceramic substrate in a simpler manner, so the fabrication cost can be reduced and a fixed time can be shortened, thus increasing the efficiency of a product.

Abstract: There is provided a patch antenna. The patch antenna includes a high dielectric constant substrate having a cavity, a radiator disposed on a portion of one surface of the high dielectric constant substrate corresponding to the cavity, a feeder line disposed on the high dielectric constant substrate and supplying a signal to the radiator, and a ground part disposed on the high dielectric constant substrate.

Abstract: There is provided a multi-layer ceramic circuit board. The multi-layer ceramic circuit board according to an aspect of the invention may include: a ceramic body having a plurality of ceramic green sheets stacked upon one another and an interlayer circuit having conductive vias and conductive patterns separately provided in the plurality of ceramic green sheets; a bump receiving portion provided in at least one surface ceramic green sheet adjacent to a surface of the plurality of ceramic green sheets, and having side walls inclined upward; and a bonding pad provided on the inclined side walls and a bottom surface of the bump receiving portion, and connected to the interlayer circuit.

Abstract: The present invention provides a ceramic substrate including: a ceramic stacked layer structure in which multiple ceramic layers are stacked to be interconnected through a via provided within each of the ceramic layers, the ceramic stacked layer structure having a hole provided therein to expose a top portion of the via provided within a ceramic layer of being a surface layer; a conductive material filled within the hole; and an external electrode formed on the surface of the ceramic stacked layer structure so that the external electrode is electrically connected to the conductive material, and a manufacturing method thereof.

Abstract: There is provided a method of manufacturing an LTCC substrate, capable of enhancing coatability of an external electrode pad, yield of the LTCC substrate as a package and product reliability and ensuring compactness of a product utilizing the LTCC substrate package. The method includes: forming a cavity on external electrode pad forming layers, respectively and filling the cavity with an external electrode pad material; depositing the external electrode pad forming layers on a ceramic stack with a printed circuit pattern formed therein; and sintering the ceramic stack having the external electrode pad forming layers deposited thereon at a low temperature.

Abstract: A high frequency module and a manufacturing method thereof In the module, a substrate has a ground. A plurality of surface mounted devices are mounted on the substrate. A metal wall is connected to the ground of the substrate. A resin molding hermetically seals the surface mounted devices and the metal wall, the resin molding formed to expose a top surface of the metal wall. Also, a metal film is formed on the resin molding to contact the top surface of the exposed metal wall.

Abstract: The invention provides a semiconductor multi-chip package including a substrate, a first semiconductor chip mounted on the substrate and a second semiconductor chip disposed directly above the first semiconductor chip. The package further includes a spacer disposed between the substrate and the second semiconductor chip to maintain a vertical interval between the first and second semiconductor chips and electrically connect the second semiconductor chip to the substrate. The invention minimizes noise generated through a bonding wire connecting the substrate with the chip to ensure stable operation of the chip, and reduces the size of the substrate and the number of mounted components, thereby achieving miniaturization of the package.