Patents by Inventor Je-Hsuing LAN

Je-Hsuing LAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130100090
    Abstract: This disclosure provides systems, methods and apparatus for electromechanical systems variable capacitance devices. In one aspect, an electromechanical systems variable capacitance device includes a substrate with a first metal layer including a first bias electrode overlying the substrate. A member suspended above the first metal layer includes a dielectric beam and a second metal layer including a first radio frequency electrode and a ground electrode. The member and the first metal layer define a first air gap. A third metal layer over the member includes a second bias electrode, and the third metal layer and the member define a second air gap. The member includes a plane of symmetry substantially parallel a plane containing the first bias electrode.
    Type: Application
    Filed: October 21, 2011
    Publication date: April 25, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Daniel FELNHOFER, Wenyue ZHANG, Je-Hsuing LAN
  • Publication number: 20130100065
    Abstract: This disclosure provides systems, methods and apparatus for electromechanical systems variable capacitance devices. In one aspect, an electromechanical systems variable capacitance device includes a substrate with a bottom bias electrode on the substrate. A first radio frequency electrode above the bottom bias electrode defines a first air gap. A non-planarized first dielectric layer is between the bottom bias electrode and the first radio frequency electrode. A metal layer above the first radio frequency electrode defines a second air gap. The metal layer includes a top bias electrode and a second radio frequency electrode.
    Type: Application
    Filed: October 21, 2011
    Publication date: April 25, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Daniel FELNHOFER, Wenyue ZHANG, Je-Hsuing LAN