Abstract: An electronic device integrally formed with an automatic switching-off structure for protecting the device from overheating. At least one conducting lead of the electronic device is mechanically and electrically connected to its corresponding electrode by means of a solder column having desired melting point, with an appropriate spacing being kept between the conducting lead and the electrode. The coating layer of the electronic device is formed by a material such as epoxy resin which will soften and release a gaseous substance when heated to a temperature near its ignition point. When the temperature of the device exceeds the melting point of the solder, the solder column melts to break the electrical circuit and prevent overheating of the device. If the electronic device per se has higher working temperature, the coating layer is formed by a material having a higher ignition point such as silicon resin or silicon rubber which will not soften and expand when heated to a temperature near its ignition point.