Abstract: Provided are a multilayer ceramic capacitor and a board having the same, the multilayer ceramic capacitor including: a capacitor body including an active region, which includes a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with respective dielectric layers interposed therebetween, and covers formed on and under the active region, respectively. The multilayer ceramic capacitor further includes external electrodes disposed on the capacitor body so as to be connected to the internal electrodes. Among the internal electrodes, an internal electrode disposed adjacently to one of the covers has at least one cutaway portion within a portion of the internal electrode connected to the external electrode, and the cutaway portion is (at least partially) filled with a dielectric material.

Abstract: Provided are a multilayer ceramic capacitor and a board having the same, the multilayer ceramic capacitor including: a capacitor body including an active region, which includes a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with respective dielectric layers interposed therebetween, and covers formed on and under the active region, respectively. The multilayer ceramic capacitor further includes external electrodes disposed on the capacitor body so as to be connected to the internal electrodes. Among the internal electrodes, an internal electrode disposed adjacently to one of the covers has at least one cutaway portion within a portion of the internal electrode connected to the external electrode, and the cutaway portion is (at least partially) filled with a dielectric material.

Abstract: A magnetic composition includes first, second, and third magnetic metal particles. The first magnetic metal particles have an average particle size of 10 ?m to 28 ?m; the second magnetic metal particles have an average particle size of 1 ?m to 4.5 ?m; and the third magnetic metal particles include insulating layers disposed on surfaces thereof and have a particle size of 300 nm or less. Therefore, eddy current loss of an inductor having a body formed of the magnetic composition may be improved, and high efficiency and inductance of the inductor may be secured.

Abstract: An inductor includes a body having a coil, a magnetic material surrounding the coil, and a resin; and an external electrode disposed on at least a surface of the body. The body disposed in the inductor includes a particle which may soften an external impact acting on the inductor, in addition to acting on the magnetic material and the resin, and the external impact may be a physical impact or a thermal impact.

Abstract: A magnetic composition includes first, second, and third magnetic metal particles. The first magnetic metal particles have an average particle size of 10 ?m to 28 ?m; the second magnetic metal particles have an average particle size of 1 ?m to 4.5 ?m; and the third magnetic metal particles include insulating layers disposed on surfaces thereof and have a particle size of 300 nm or less. Therefore, eddy current loss of an inductor having a body formed of the magnetic composition may be improved, and high efficiency and inductance of the inductor may be secured.

Abstract: A magnetic composition includes first, second, and third magnetic metal particles. The first magnetic metal particles have an average particle size of 10 ?m to 28 ?m; the second magnetic metal particles have an average particle size of 1 ?m to 4.5 ?m; and the third magnetic metal particles include insulating layers disposed on surfaces thereof and have a particle size of 300 nm or less. Therefore, eddy current loss of an inductor having a body formed of the magnetic composition may be improved, and high efficiency and inductance of the inductor may be secured.

Abstract: A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes disposed to face each other with at least one among the plurality of dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part. The inductor and the capacitor are coupled to each other by an adhesive containing a first epoxy resin including a urethane modified epoxy (UME) resin, a second epoxy resin including a bisphenol A type resin, and a latent curing agent.

Abstract: An inductor includes a body having a coil, a magnetic material surrounding the coil, and a resin; and an external electrode disposed on at least a surface of the body. The body disposed in the inductor includes a particle which may soften an external impact acting on the inductor, in addition to acting on the magnetic material and the resin, and the external impact may be a physical impact or a thermal impact.

Abstract: A magnetic composition includes first, second, and third magnetic metal particles. The first magnetic metal particles have an average particle size of 10 ?m to 28 ?m; the second magnetic metal particles have an average particle size of 1 ?m to 4.5 ?m; and the third magnetic metal particles include insulating layers disposed on surfaces thereof and have a particle size of 300 nm or less. Therefore, eddy current loss of an inductor having a body formed of the magnetic composition may be improved, and high efficiency and inductance of the inductor may be secured.

Abstract: A chip electronic component includes a body including a coil portion disposed therein and a magnetic metallic powder, and a stress buffer layer disposed on a surface of the body. A Young's modulus of the stress buffer layer is less than that of the body.

Abstract: There is provided a chip electronic component including: a magnetic body containing magnetic metal powder particles and a thermosetting resin; an internal coil part embedded in the magnetic body; and a surface protection layer with which a surface of the magnetic body is coated. The surface protection layer may prevent a plating spreading phenomenon occurring on a surface of the chip electronic component at the time of forming external electrodes.

Abstract: A multilayer ceramic electronic component includes a ceramic body including internal electrodes and dielectric layers, and an electrode layer disposed on at least one surface of the ceramic body and electrically connected to the internal electrodes. A conductive resin layer containing metal particles and a base resin is disposed on the electrode layer. When a weight ratio of metal to carbon in a surface portion of the conductive resin layer is defined as A, and a weight ratio of metal to carbon in an internal portion of the conductive resin layer is defined as B, A is greater than B.

Abstract: A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes disposed to face each other with at least one among the plurality of dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part. The inductor and the capacitor are coupled to each other by an adhesive containing a first epoxy resin including a urethane modified epoxy (UME) resin, a second epoxy resin including a bisphenol A type resin, and a latent curing agent.

Abstract: A multilayer ceramic capacitor includes a ceramic body including dielectric layers and internal electrodes; an electrode layer disposed on an outer surface of the ceramic body and electrically connected to the internal electrodes; a first composite resin layer disposed on the electrode layer and including a first conductive powder; and a second composite resin layer disposed on the first composite resin layer and including a second conductive powder different from the first conductive powder.

Abstract: There is provided a chip electronic component including: a magnetic body containing magnetic metal powder particles and a thermosetting resin; an internal coil part embedded in the magnetic body; and a surface protection layer with which a surface of the magnetic body is coated. The surface protection layer may prevent a plating spreading phenomenon occurring on a surface of the chip electronic component at the time of forming external electrodes.

Abstract: A multilayer ceramic electronic component includes a ceramic body including internal electrodes and dielectric layers, and an electrode layer disposed on at least one surface of the ceramic body and electrically connected to the internal electrodes. A conductive resin layer containing metal particles and a base resin is disposed on the electrode layer. When a weight ratio of metal to carbon in a surface portion of the conductive resin layer is defined as A, and a weight ratio of metal to carbon in an internal portion of the conductive resin layer is defined as B, A is greater than B.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and internal electrodes; an electrode layer disposed on an outer surface of the ceramic body and electrically connected to the internal electrodes; a first composite resin layer disposed on the electrode layer and including a first conductive powder; and a second composite resin layer disposed on the first composite resin layer and including a second conductive powder different from the first conductive powder.