Abstract: An apparatus for manufacturing a display device includes: a light source for generating a first beam; a beam converter including an axicon lens for converting the first beam into a second beam and a relay lens for converting the second beam into a third beam; a scanner including a first mirror for reflecting the third beam in a first direction and a second mirror for reflecting the third beam in a second direction different from the first direction; and a scan lens having an effective focal length and being for converting the third beam output from the scanner into a fourth beam. The scan lens including first through fifth lens respectively having first through fifth focal lengths and a cover window. An absolute value of the first focal length is smaller than an absolute value of each of the second through fifth focal lengths.

Abstract: A laser processing apparatus includes a laser source which generates a laser beam; a scanner unit disposed in an optical path of the laser beam from the laser source and which adjusts the optical path of the laser beam from the laser source in a first direction or in a second direction different from the first direction; and a reflector unit disposed in an optical path of the laser beam adjusted by the scanner unit and which reflects the laser beam adjusted by the scanner unit, where the reflector unit includes a first sub-reflector unit which shifts an optical path of the laser adjusted by the scanner unit in the first direction, and a second sub-reflector unit which shifts an optical path of the laser beam adjusted by the scanner unit in a third direction opposite to the first direction.

Abstract: A laser device includes a light source part; an optical path adjustment part; a light distribution part that splits a laser beam into a plurality of sub-beams to a substrate; a drive part that moves the light distribution part and adjusts relative positions between the light distribution part and the substrate; a sensing part; and a control part. The control part generates an image based on a signal sensed by the sensing part and measures an image contrast of the image. The control part records and compares a plurality of image contrasts according to the position of the light distribution part to determine an optimal position of the light distribution part.

Abstract: A laser crystallization apparatus according to an embodiment includes: a light source unit which irradiates a laser beam; and a path conversion unit which converts the laser beam incident from the light source unit into a linear beam having a long axis parallel to a first direction and a short axis parallel to a second direction. The linear beam propagates in a third direction perpendicular to the first direction and the second direction, the path conversion unit includes an incident window extending parallel to a first length direction, an emission window extending parallel to a second direction, a first reflection unit disposed at the same side with the incident window, and a second reflection unit disposed at the same side with the emission window, and the second length direction extends parallel to the first direction in a view of the third direction.

Abstract: A laser crystallization apparatus according to an embodiment includes a light source unit irradiating a laser beam; and an optical unit to which the laser beam is incident, wherein the optical unit includes a first portion and a second portion bonded to each other on a bonded surface, and a first width of the first portion and a second width of the second portion are the same as each other on the bonded surface based on a direction parallel to the incident direction of the laser beam.

Abstract: A laser processing apparatus includes a laser source which generates a laser beam; a scanner unit disposed in an optical path of the laser beam from the laser source and which adjusts the optical path of the laser beam from the laser source in a first direction or in a second direction different from the first direction; and a reflector unit disposed in an optical path of the laser beam adjusted by the scanner unit and which reflects the laser beam adjusted by the scanner unit, where the reflector unit includes a first sub-reflector unit which shifts an optical path of the laser adjusted by the scanner unit in the first direction, and a second sub-reflector unit which shifts an optical path of the laser beam adjusted by the scanner unit in a third direction opposite to the first direction.

Abstract: A laser processing apparatus includes a laser source which generates a laser beam; a scanner unit disposed in an optical path of the laser beam from the laser source and which adjusts the optical path of the laser beam from the laser source in a first direction or in a second direction different from the first direction; and a reflector unit disposed in an optical path of the laser beam adjusted by the scanner unit and which reflects the laser beam adjusted by the scanner unit, where the reflector unit includes a first sub-reflector unit which shifts an optical path of the laser adjusted by the scanner unit in the first direction, and a second sub-reflector unit which shifts an optical path of the laser beam adjusted by the scanner unit in a third direction opposite to the first direction.

Abstract: A laser processing apparatus includes a laser beam generating unit which emits a laser beam, a lens unit which divides the laser beam into a plurality of laser beams, and a light condensing unit which condenses the plurality of laser beams. The lens unit includes a first lens array having a first central axis and a second lens array having a second central axis, and wherein at least one of the first lens array and the second lens array reciprocates such that the first central axis and the second central axis are deviated from each other.

Abstract: A crystallization apparatus for crystallizing a semiconductor layer formed on a substrate. The crystallization apparatus includes a laser generator, which generates a laser beam, an optical device for changing a path of the laser beam emitted from the laser generating device, and a stage on which the substrate is arranged, wherein the optical device changes the path of the laser beam by rotating with respect to a constant axis, and the stage is moved so that the laser beam having the changed path is irradiated to a constant region on the semiconductor layer.

Abstract: A laser processing apparatus includes a laser beam generating unit which emits a laser beam, a lens unit which divides the laser beam into a plurality of laser beams, and a light condensing unit which condenses the plurality of laser beams. The lens unit includes a first lens array having a first central axis and a second lens array having a second central axis, and wherein at least one of the first lens array and the second lens array reciprocates such that the first central axis and the second central axis are deviated from each other.

Abstract: A laser processing apparatus includes a laser source which generates a laser beam; a scanner unit disposed in an optical path of the laser beam from the laser source and which adjusts the optical path of the laser beam from the laser source in a first direction or in a second direction different from the first direction; and a reflector unit disposed in an optical path of the laser beam adjusted by the scanner unit and which reflects the laser beam adjusted by the scanner unit, where the reflector unit includes a first sub-reflector unit which shifts an optical path of the laser adjusted by the scanner unit in the first direction, and a second sub-reflector unit which shifts an optical path of the laser beam adjusted by the scanner unit in a third direction opposite to the first direction.

Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

Abstract: A laser beam mixing apparatus to convert a laser beam bundle into a single laser beam having a uniform energy density. The laser beam mixing apparatus includes: a barrel to adjust a distance between a multi-core optical cable and an optical lens included therein, to convert a laser beam bundle into a single beam; and a stage to adjust the position and angle a single-core optical cable with respect to the optical lens, to align the core of the single-core optical cable with the center of the single beam.

Abstract: A method of excimer laser annealing includes generating a focused long line beam with a laser beam output from at least one laser source; and scanning the long line beam in a direction perpendicular to a long axis of the long line beam along a surface of an amorphous semiconductor film on a substrate. The long line beam has a normalized beam angular divergence half-width ?=arctan(tan ?y/sin ?) that is less than a critical value ?c, where ?y represents a beam angular divergence half-width measured along the long axis of the long line beam on the surface of the amorphous semiconductor film, ? represents a mean incidence angle of the long line beam on the surface of the amorphous semiconductor film, and ?c is approximately 30°.

Abstract: A method for performing a laser crystallization is provided. The method includes generating a laser beam, refracting the laser beam to uniformize an intensity of the laser beam at a focal plane of the laser beam. The laser beam whose intensity is uniformized is applied into an object substrate mounted with a stage.

Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

Abstract: Apparatus for uniformizing light amount distribution by shaking line beams along a longitudinal axis direction is provided. The apparatus includes a mirror mount, a mirror, an actuator, and a deformation member. The mirror fixed to the mirror mount and includes a reflective surface. The actuator is disposed at a distance from the mirror mount and configured to repeat expansion and contraction along a first direction. The deformation member includes a plurality of blocks connected to each other by flexible joints and is coupled to the actuator and the mirror mount. The deformation member is configured to change a displacement in the first direction due to operation of the actuator to a displacement in a second direction that crosses the first direction, amplify the changed displacement, and transmit the amplified displacement to the mirror mount.

Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

Abstract: A laser irradiation apparatus is provided. The laser irradiation apparatus includes a laser beam generator configured to generate laser beams; a slit unit configured to selectively transmit the laser beams; a mirror unit configured to change a path of the selectively transmitted laser beams, so as to irradiate the selectively transmitted laser beams onto a processing target; a first optical system, wherein a first portion of the selectively transmitted laser beams penetrates through the mirror unit and is projected to the first optical system; and a second optical system, wherein a second portion of the selectively transmitted laser beams penetrates through the mirror unit and is projected to the second optical system.