Patents by Inventor Je-Kwon Park

Je-Kwon Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11941876
    Abstract: An appliance includes a camera for calibrating and determining whether the door of the appliance is in a closed position. A controller is operably coupled to the camera. The controller is configured for obtaining one or more images of the appliance chamber or door. An artificial intelligence image recognition process is used to perform image classification and establish a baseline image to determine whether subsequent closing of the appliance door is successful. In the event of a failure to obtain the baseline image or a determination that the door is not closed, operation of the appliance may be disabled.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: March 26, 2024
    Assignee: Haier US Appliance Solutions, Inc.
    Inventors: Je Kwon Yoon, Seung-Yeong Park, Hyoyeol Maeng
  • Publication number: 20080205746
    Abstract: In a method of inspecting an identification mark, an image of the identification mark on a semiconductor wafer is obtained. The identification mark may be identified using the identification mark image. A region where the identification mark is formed may be inspected using the identification mark image after the identification mark is identified.
    Type: Application
    Filed: February 26, 2008
    Publication date: August 28, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Kyun KO, Young-Kyu LIM, Je-Kwon PARK, Hyun-Hee KIM, Kyu LEE
  • Publication number: 20080037857
    Abstract: In a method of classifying directional defects on an object straight lines are drawn from any defect among all defects on the object toward adjacent defects. At least three defects that are positioned within an allowable angle from the straight lines are classified as directional defects. Thus, only the directional defects among all the defects on the semiconductor substrate may be accurately classified after performing a chemical mechanical polishing (CMP) process, so that the CMP process may be effectively managed.
    Type: Application
    Filed: April 25, 2007
    Publication date: February 14, 2008
    Inventors: Young-Kyu Lim, Byung-Am Lee, Je-Kwon Park, Jae-Kyun Ko, Kyu Lee, Kyoung-Hee Park