Abstract: The present invention relates to a composition for use in preventing, alleviating, or treating inflammatory disease, or an anti-inflammatory composition, which comprises: ?-1,3-glucan; and the peptide composed of the amino acid sequence of SEQ ID NO: 4. The present invention also relates to an antibacterial composition against bacteria causative of sepsis, which comprises: ?-1,3-glucan; the peptide composed of the amino acid sequence of SEQ ID NO: 4; and an antibiotic. The present invention also relates to a method for preventing or treating an inflammatory disease, the method comprising a step of administering ?-1,3-glucan; and the peptide composed of the amino acid sequence of SEQ ID NO: 4 to a patient.

Abstract: The present invention relates to a composition for relieving a hangover or a composition for preventing, alleviating or treating alcoholic liver disease, comprising a ?-glucan as an active ingredient.

Abstract: The present invention relates to a composition for use in preventing, alleviating, or treating inflammatory disease, or an anti-inflammatory composition, which comprises: ?-1,3-glucan; and the peptide composed of the amino acid sequence of SEQ ID NO: 4. The present invention also relates to an antibacterial composition against bacteria causative of sepsis, which comprises: ?-1,3-glucan; the peptide composed of the amino acid sequence of SEQ ID NO: 4; and an antibiotic. The present invention also relates to a method for preventing or treating an inflammatory disease, the method comprising a step of administering ?-1,3-glucan; and the peptide composed of the amino acid sequence of SEQ ID NO: 4 to a patient.

Abstract: The present invention relates to a composition for relieving a hangover or a composition for preventing, alleviating or treating alcoholic liver disease, comprising a ?-glucan as an active ingredient

Abstract: The present invention relates to a composition for preventing or treating obesity, comprising a supplement for reducing body fat and a ?-glucan as active ingredients.

Abstract: Disclosed herein are a method for surface-treating a printed circuit board and a printed circuit board including a surface treatment layer. The method includes: plasma-treating a surface of a printed circuit board; treating the plasma-treated substrate with an organic solderability preserve; performing heat treatment on the substrate treated with the organic solderability preserve; printing a solder paste on the substrate subjected to the heat treatment; reflowing the solder paste printed substrate to fix the solder paste; and deflux washing the resulting substrate. According to the present invention, the discoloration problem due to oxidation of copper can be solved by performing heat treatment under predetermined conditions after treatment with an organic solderability preserve. Therefore, the present invention can meet various multi-reflow processes, as compared with products of the related art.

Abstract: Disclosed herein are a method for surface-treating a printed circuit board and a printed circuit board including a surface treatment layer. The method includes: plasma-treating a surface of a printed circuit board; treating the plasma-treated substrate with an organic solderability preserve; performing heat treatment on the substrate treated with the organic solderability preserve; printing a solder paste on the substrate subjected to the heat treatment; reflowing the solder paste printed substrate to fix the solder paste; and deflux washing the resulting substrate. According to the present invention, the discoloration problem due to oxidation of copper can be solved by performing heat treatment under predetermined conditions after treatment with an organic solderability preserve. Therefore, the present invention can meet various multi-reflow processes, as compared with products of the related art.

Abstract: Disclosed herein is a method for manufacturing a printed circuit board, the method including: preparing a base substrate having a connection pad; forming a surface treatment layer on the connection pad; refrigeration-treating the base substrate having the connection pad on which the surface treatment layer is formed; and printing a solder paste on the connection pad of the refrigeration-treated base substrate.