Patents by Inventor Je Kyung PARK

Je Kyung PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240127470
    Abstract: In a method of predicting a position of an object at a future time point for a vehicle, video image information at a current time point and at a plurality of time points before the current time point acquired through a camera of the vehicle may be extracted as semantic segmentation image. A mask image imaging an attribute and position information of an object present in each of the video images may be extracted. A position distribution of the object may be predicted by deriving a plurality of hypotheses for a position of the object at a future time point through deep learning by receiving video images at the current time point and the time points before the current time point, a plurality of semantic segmentation images, a plurality of mask images, and ego-motion information of the vehicle, and calculating the plurality of hypotheses as a Gaussian mixture probability distribution.
    Type: Application
    Filed: March 23, 2023
    Publication date: April 18, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, Ewha University - Industry Collaboration Foundation
    Inventors: Hyung-Wook Park, Jang-Ho Shin, Seo-Young Jo, Je-Won Kang, Jung-Kyung Lee
  • Publication number: 20240004271
    Abstract: The camera module comprises: a housing; a lens holder disposed inside the housing; a lens module disposed inside the lens holder; and a printed circuit board disposed at a lower portion of the housing and including an image sensor facing the lens module, wherein the lens module is screw-coupled to an inner surface of the lens holder, wherein the lens holder is screw-coupled to an inner surface of the housing, and wherein the screw-coupled region of the lens module is disposed more adjacent to an upper end of the lens module than a lower end thereof.
    Type: Application
    Filed: December 9, 2021
    Publication date: January 4, 2024
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sun Min HWANG, Je Kyung PARK
  • Patent number: 11863850
    Abstract: Provided is a camera module. The camera module according to one aspect of the present invention comprises: a housing; a substrate arranged on the housing; a substrate supporting member arranged on the housing and supporting the substrate; and a coupling member that fixes the substrate on the housing, wherein the substrate supporting member includes a body, an extending portion which extends from the body to be disposed between the substrate and the inside surface of the housing, a hole formed in the extending portion, and a bent portion which extends from the extending portion inwardly of the hole and towards the substrate.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: January 2, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Da Hin Moon, Je Kyung Park
  • Publication number: 20230418020
    Abstract: A camera module comprises: a lens holder including side parts and a top part having an opening; a lens module coupled to the lens holder; and a substrate, which is coupled to the lens holder and has an image sensor arranged thereon, wherein the lens module has a first protrusion part arranged under the top part of the lens holder, and includes a first coupling member for coupling the first protrusion part to the top part of the lens holder.
    Type: Application
    Filed: October 14, 2021
    Publication date: December 28, 2023
    Inventors: Sun Min HWANG, Je Kyung PARK
  • Patent number: 11758251
    Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.
    Type: Grant
    Filed: June 3, 2022
    Date of Patent: September 12, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jae Wook Ahn, Sun Min Hwang, Je Kyung Park, Kyung Mok Yoon, Chul Ho Lee, Jong Chul Choi
  • Patent number: 11747718
    Abstract: The present invention relates to a camera module. A camera module according to one aspect comprises: a lens barrel in which a lens part is disposed; a substrate part including a substrate that is disposed below the lens barrel; a housing coupled to the lens barrel; and a heating member electrically connected to the substrate part, wherein the lens barrel includes a first region in which a lens is disposed and a second region disposed spaced apart from the first region, and the heating member is disposed between the first region and the second region.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: September 5, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Je Kyung Park
  • Publication number: 20220311913
    Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.
    Type: Application
    Filed: June 3, 2022
    Publication date: September 29, 2022
    Inventors: Jae Wook AHN, Sun Min HWANG, Je Kyung PARK, Kyung Mok YOON, Chul Ho LEE, Jong Chul CHOI
  • Patent number: 11381718
    Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: July 5, 2022
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jae Wook Ahn, Sun Min Hwang, Je Kyung Park, Kyung Mok Yoon, Chul Ho Lee, Jong Chul Choi
  • Publication number: 20220082906
    Abstract: The present invention relates to a camera module. A camera module according to one aspect comprises: a lens barrel in which a lens part is disposed; a substrate part including a substrate that is disposed below the lens barrel; a housing coupled to the lens barrel; and a heating member electrically connected to the substrate part, wherein the lens barrel includes a first region in which a lens is disposed and a second region disposed spaced apart from the first region, and the heating member is disposed between the first region and the second region.
    Type: Application
    Filed: November 22, 2021
    Publication date: March 17, 2022
    Applicant: LG INNOTEK CO., LTD.
    Inventor: Je Kyung PARK
  • Publication number: 20220046146
    Abstract: Provided is a camera module. The camera module according to one aspect of the present invention comprises: a housing; a substrate arranged on the housing; a substrate supporting member arranged on the housing and supporting the substrate; and a coupling member that fixes the substrate on the housing, wherein the substrate supporting member includes a body, an extending portion which extends from the body to be disposed between the substrate and the inside surface of the housing, a hole formed in the extending portion, and a bent portion which extends from the extending portion inwardly of the hole and towards the substrate.
    Type: Application
    Filed: December 19, 2019
    Publication date: February 10, 2022
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Da Hin MOON, Je Kyung PARK
  • Patent number: 11221543
    Abstract: The present invention relates to a camera module. A camera module according to one aspect comprises: a lens barrel in which a lens part is dispose& a substrate part including a substrate that is disposed below the lens barrel; a housing coupled to the lens barrel; and a heating member electrically connected to the substrate part, wherein the lens barrel includes a first region in which a lens is disposed and a second region disposed spaced apart from the first region, and the heating member is disposed between the first region and the second region.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: January 11, 2022
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Je Kyung Park
  • Patent number: 11140300
    Abstract: The present embodiment provides a camera module comprising: a lens barrel containing at least one lens; a front body which contains the lens barrel, and which comprises a flange portion formed to extend from a side surface thereof in a direction perpendicular to an optical axis; a substrate portion spaced from the lens barrel in the optical axis direction and arranged behind the front body; a rear body coupled to the flange portion so as to contain the substrate portion; a thermal bonding portion arranged between the flange portion and the rear body such that the front body and the rear body are coupled; and a gasket spaced from the thermal bonding portion and arranged between the front body and the rear body so as to contact the front body and the rear body, wherein the front surface of the flange portion, which is positioned to correspond to the thermal bonding portion, comprises a planar surface.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: October 5, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Je Kyung Park, Da Hin Moon, Jong Won Jeon
  • Publication number: 20210211562
    Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.
    Type: Application
    Filed: March 16, 2021
    Publication date: July 8, 2021
    Inventors: Jae Wook AHN, Sun Min HWANG, Je Kyung PARK, Kyung Mok YOON, Chul Ho LEE, Jong Chul CHOI
  • Patent number: 10979606
    Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: April 13, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jae Wook Ahn, Sun Min Hwang, Je Kyung Park, Kyung Mok Yoon, Chul Ho Lee, Jong Chul Choi
  • Patent number: 10859785
    Abstract: The present embodiment provides a camera module and a vehicle comprising same, the camera module comprising: a lens barrel accommodating at least one lens; a front body accommodating the lens barrel; a substrate assembly which couples with the front body, is disposed so as to be spaced apart from the lens barrel, and comprises at least one substrate so as to have an image sensor and a connector mounted thereon; a shield can which couples with the substrate assembly so as to accommodate at least one portion of the substrate assembly; and a rear body which couples with the front body and accommodates the substrate assembly and the shield can. The shield can comprises: a hole formed in a position corresponding to the connector; and a connection member which is bent and extends towards the inside from the hole. The connector passes through the hole, and the connector has a ground part disposed on the outer surface thereof so that the ground part and the connection member electrically make contact.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: December 8, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Je Kyung Park, Da Hin Moon, Chul Ho Lee, Sun Min Hwang
  • Publication number: 20200292918
    Abstract: The present invention relates to a camera module. A camera module according to one aspect comprises: a lens barrel in which a lens part is dispose& a substrate part including a substrate that is disposed below the lens barrel; a housing coupled to the lens barrel; and a heating member electrically connected to the substrate part, wherein the lens barrel includes a first region in which a lens is disposed and a second region disposed spaced apart from the first region, and the heating member is disposed between the first region and the second region.
    Type: Application
    Filed: November 29, 2018
    Publication date: September 17, 2020
    Applicant: LG INNOTEK CO., LTD.
    Inventor: Je Kyung PARK
  • Patent number: 10732488
    Abstract: A holder assembly for a camera module comprises: a lens; a lens body containing the lens; a protrusion protruding from a side surface of the lens body; a lens holder containing the lens body and the protrusion; and a waterproof member contained in the lens holder such that the protrusion and the lens holder are bonded.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: August 4, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sun Min Hwang, Je Kyung Park, Jong Won Jeon, Kwang Sung Kim
  • Patent number: 10599014
    Abstract: The present invention relates to a camera module, comprising: a lens barrel including a body part, and an extension part extending outwardly from the body part; a front body including a through hole into which the body part is inserted, and a placing part on the top of which the extension part is disposed; and an adhesive disposed between the extension part and the placing part, wherein a concave-convex part may be formed on the placing part. The present invention has an effect of enhancing adhesive force between the lens barrel and the front body, thereby maintaining airtightness of an inner space and improving reliability and stability.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: March 24, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Je Kyung Park, Myoung Jin An
  • Publication number: 20200053258
    Abstract: The present embodiment provides a camera module comprising: a lens barrel containing at least one lens; a front body which contains the lens barrel, and which comprises a flange portion formed to extend from a side surface thereof in a direction perpendicular to an optical axis; a substrate portion spaced from the lens barrel in the optical axis direction and arranged behind the front body; a rear body coupled to the flange portion so as to contain the substrate portion; a thermal bonding portion arranged between the flange portion and the rear body such that the front body and the rear body are coupled; and a gasket spaced from the thermal bonding portion and arranged between the front body and the rear body so as to contact the front body and the rear body, wherein the front surface of the flange portion, which is positioned to correspond to the thermal bonding portion, comprises a planar surface.
    Type: Application
    Filed: September 29, 2017
    Publication date: February 13, 2020
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Je Kyung PARK, Da Hin MOON, Jong Won JEON
  • Publication number: 20190387136
    Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.
    Type: Application
    Filed: August 28, 2019
    Publication date: December 19, 2019
    Inventors: Jae Wook AHN, Sun Min HWANG, Je Kyung PARK, Kyung Mok YOON, Chul Ho LEE, Jong Chul CHOI