Patents by Inventor Jea-Myung Kim

Jea-Myung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pellet-type foams of non-crosslinked polypropylene resin having lower melting point and process and device for producing the same and molded foams therefrom
    Patent number: 7118362
    Abstract: The present invention relates to a pellet-type non-crosslinked polypropylene foam having a melting point of 125 to 140° C., and a process and device for producing said foam. Since the pellet-type foams of non-crosslinked polypropylene of the present invention has a lower melting point and a closed cell content of 80% or more, it is advantageous to mold such foams. The present invention also relates to an article molded from the above pellet-type non-crosslinked polypropylene foams.
    Type: Grant
    Filed: May 15, 2002
    Date of Patent: October 10, 2006
    Assignee: A San Chemicals, Co., Ltd.
    Inventors: Hee-Sung Lee, Chul Lee, Ryeong Lee, Jea-Myung Kim
  • Pellet-type foams of non-crosslinked polypropylene resin having lower melting point and process and device for producing the same and molded foams therefrom
    Publication number: 20040249008
    Abstract: The present invention relates to a pellet-type non-crosslinked polypropylene foam having a melting point of 125 to 140□, and a process and device for producing said foam. Since the pellet-type foams of non-crosslinked polypropylene of the present invention has a lower melting point and a closed cell content of 80% or more, it is advantageous to mold such foams. The present invention also relates to an article molded from the above pellet-type non-crosslinked polypropylene foams.
    Type: Application
    Filed: November 18, 2003
    Publication date: December 9, 2004
    Inventors: Hee-Sung Lee, Chul Lee, Ryeong Lee, Jea-Myung Kim