Patents by Inventor Jea Sik Ryoo

Jea Sik Ryoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Porous sheet and method for manufacturing the porous sheet
    Patent number: 8876994
    Abstract: The present invention relates to a porous sheet and a method for manufacturing the porous sheet. A porous sheet including a fine-fiber web layer and a support layer and a method for manufacturing the same are provided, and it is possible to implement a porous sheet with sufficient strength and thickness to be used in peeling and laminating processes of a multilayer ceramic capacitor.
    Type: Grant
    Filed: September 15, 2012
    Date of Patent: November 4, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jun Hwan Yoo, Jin Wook Na, Jea Sik Ryoo, Sun Ok Kim
  • POROUS SHEET AND METHOD FOR MANUFACTURING THE POROUS SHEET
    Publication number: 20140235130
    Abstract: The present invention relates to a porous sheet and a method for manufacturing the porous sheet. A porous sheet including a fine-fiber web layer and a support layer and a method for manufacturing the same are provided, and it is possible to implement a porous sheet with sufficient strength and thickness to be used in peeling and laminating processes of a multilayer ceramic capacitor.
    Type: Application
    Filed: April 14, 2014
    Publication date: August 21, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jun Hwan YOO, Jin Wook NA, Jea Sik RYOO, Sun Ok KIM
  • POROUS SHEET AND METHOD FOR MANUFACTURING THE POROUS SHEET
    Publication number: 20130078882
    Abstract: The present invention relates to a porous sheet and a method for manufacturing the porous sheet. A porous sheet including a fine-fiber web layer and a support layer and a method for manufacturing the same are provided, and it is possible to implement a porous sheet with sufficient strength and thickness to be used in peeling and laminating processes of a multilayer ceramic capacitor.
    Type: Application
    Filed: September 15, 2012
    Publication date: March 28, 2013
    Inventors: Jun Hwan YOO, Jin Wook Na, Jea Sik Ryoo, Sun Ok Kim