Patents by Inventor Jea Un JIN

Jea Un JIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light-emitting diode package having controlled beam angle and light-emitting device using same
    Patent number: 11848196
    Abstract: A light-emitting diode package having a controlled beam angle is proposed. The diode package can include at least one first lead frame; at least one second lead frame formed to correspond to and be spaced apart from the at least one first lead frame; light-emitting diode chips mounted on the at least one first lead frame; a first package main body which is fixed on the partial surfaces of the at least one first lead frame and the at least one second lead frame and formed so as to have a first inclined side at a portion of the circumference around the light-emitting diode chips; and a second package main body formed so as to have a second inclined side at the remaining portion of the circumference around the light-emitting diode chips other than the portion.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: December 19, 2023
    Inventor: Jea Un Jin
  • LIGHT-EMITTING DIODE PACKAGE HAVING CONTROLLED BEAM ANGLE AND LIGHT-EMITTING DEVICE USING SAME
    Publication number: 20210399182
    Abstract: A light-emitting diode package having a controlled beam angle is proposed. The diode package can include at least one first lead frame; at least one second lead frame formed to correspond to and be spaced apart from the at least one first lead frame; light-emitting diode chips mounted on the at least one first lead frame; a first package main body which is fixed on the partial surfaces of the at least one first lead frame and the at least one second lead frame and formed so as to have a first inclined side at a portion of the circumference around the light-emitting diode chips; and a second package main body formed so as to have a second inclined side at the remaining portion of the circumference around the light-emitting diode chips other than the portion.
    Type: Application
    Filed: July 31, 2019
    Publication date: December 23, 2021
    Inventor: Jea Un JIN