Patents by Inventor Jean Chan
Jean Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11926138Abstract: Fibrous structures, for example sanitary tissue products, such as toilet tissue, and more particularly fibrous structures containing a movable surface and methods for making same and methods for making same are provided.Type: GrantFiled: November 17, 2021Date of Patent: March 12, 2024Assignee: The Procter & Gamble CompanyInventors: Joerg Kleinwaechter, Eric Bryan Bond, Matthew Gary McKee, Hasan Eroglu, Tyler Jacob Werner, Jeffrey Chan, Joshua Thomas Fung, Jeffrey Glen Sheehan, Paul Dennis Trokhan, Jean A. Ibrahim
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Patent number: 11706902Abstract: A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.Type: GrantFiled: August 19, 2021Date of Patent: July 18, 2023Assignee: AEM SINGAPORE PTE. LTD.Inventors: See Jean Chan, Zhaomeng Wang
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Patent number: 11454666Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.Type: GrantFiled: September 16, 2020Date of Patent: September 27, 2022Assignee: AEM SINGAPORE PTE LTDInventors: See Jean Chan, Zhaomeng Wang, Yao Kun Leonard Mak, MuralliKrishna Govindandhanasekaran
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Patent number: 11378615Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.Type: GrantFiled: September 16, 2020Date of Patent: July 5, 2022Assignee: AEM SINGAPORE PTE LTDInventors: See Jean Chan, Zhaomeng Wang, Yao Kun Leonard Mak, MuralliKrishna Govindandhanasekaran
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Publication number: 20210385968Abstract: A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.Type: ApplicationFiled: August 19, 2021Publication date: December 9, 2021Inventors: See Jean Chan, Zhaomeng Wang
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Patent number: 11181575Abstract: A compact tester including a housing having a base plate and a roof plate being parallel and defining a space therebetween. The compact tester includes one or more device-under-test press units having an actuator and a contact head movable by the actuator. The compact tester includes a reinforcement arrangement having a roof reinforcement sub-arrangement coupled to the roof plate and an upright reinforcement sub-arrangement coupled to the base plate. The upright reinforcement sub-arrangement includes a pair of reinforcing side walls extending upright from the base plate. The roof reinforcement sub-arrangement includes a reinforcing structure having a reinforcing panel portion attached flat against the roof plate and an elongated reinforcing rib portion protruding from the reinforcing panel portion and away from the roof plate.Type: GrantFiled: July 8, 2020Date of Patent: November 23, 2021Assignee: AEM Singapore Pte. Ltd.Inventors: See Jean Chan, Shiau Fen Lau, Jiun Pin Goh, Zhaomeng Wang, Seenivas Rao Balachandran, Leonard Yao Kun Mak, Prabaharan Pichaiyan
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Publication number: 20210325453Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.Type: ApplicationFiled: September 16, 2020Publication date: October 21, 2021Applicant: AEM SINGAPORE PTE LTDInventors: See Jean CHAN, Zhaomeng WANG, Yao Kun Leonard MAK, MuralliKrishna GOVINDANDHANASEKARAN
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Publication number: 20210325452Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.Type: ApplicationFiled: September 16, 2020Publication date: October 21, 2021Applicant: AEM SINGAPORE PTE LTDInventors: See Jean CHAN, Zhaomeng WANG, Yao Kun Leonard MAK, MuralliKrishna GOVINDANDHANASEKARAN
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Patent number: 11129297Abstract: A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.Type: GrantFiled: January 28, 2020Date of Patent: September 21, 2021Assignee: AEM SINGAPORE PTE. LTD.Inventors: See Jean Chan, Zhaomeng Wang
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Publication number: 20210011078Abstract: A compact tester including a housing having a base plate and a roof plate being parallel and defining a space therebetween. The compact tester includes one or more device-under-test press units having an actuator and a contact head movable by the actuator. The compact tester includes a reinforcement arrangement having a roof reinforcement sub-arrangement coupled to the roof plate and an upright reinforcement sub-arrangement coupled to the base plate. The upright reinforcement sub-arrangement includes a pair of reinforcing side walls extending upright from the base plate. The roof reinforcement sub-arrangement includes a reinforcing structure having a reinforcing panel portion attached flat against the roof plate and an elongated reinforcing rib portion protruding from the reinforcing panel portion and away from the roof plate.Type: ApplicationFiled: July 8, 2020Publication date: January 14, 2021Inventors: See Jean Chan, Shiau Fen Lau, Jiun Pin Goh, Zhaomeng Wang, Seenivas Rao Balachandran, Leonard Yao Kun Mak, Prabaharan Pichaiyan
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Publication number: 20200383238Abstract: A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.Type: ApplicationFiled: January 28, 2020Publication date: December 3, 2020Inventors: See Jean Chan, Zhaomeng Wang
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Publication number: 20180354142Abstract: An automated picking apparatus for picking an object disposed on a surface. The automated picking apparatus comprises: a picking device displaceable toward the surface for picking the object; a compensator device co-operably connected to the picking device, the compensator device comprising a first magnet and a second magnet separated by a distance and arranged to repel away from each other; and an actuating mechanism operable for displacing the picking device toward the surface for picking the object, wherein operation of the actuating mechanism activates the compensator device and displaces the picking device co-operably connected thereto; wherein activation of the compensator device reduces the distance between the first and second magnetic elements thereof; and wherein continued operation of the actuating mechanism subsequent to contact between the picking device and the object further reduces the distance between the first and second magnetic elements of the compensator device.Type: ApplicationFiled: June 30, 2016Publication date: December 13, 2018Inventor: See Jean Chan
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Patent number: 9927478Abstract: A configurable electronic test system that is adapted for varying test processes and thermal conditions, consisting of a device handler working with multiple testers and a thermal environment module for controlling the thermal condition during test. The test system can be easily expanded by stacking more testers vertically for more test capacity without requiring an increase in floor space.Type: GrantFiled: October 27, 2015Date of Patent: March 27, 2018Assignee: AEM SINGAPORE PTE. LTD.Inventors: Boon Hua How, Kok Keong Ong, Chiang Huan Saw, See Jean Chan, Wee Tick Lo
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Publication number: 20170010313Abstract: A configurable electronic test system that is adapted for varying test processes and thermal conditions, consisting of a device handler working with multiple testers and a thermal environment module for controlling the thermal condition during test. The test system can be easily expanded by stacking more testers vertically for more test capacity without requiring an increase in floor space.Type: ApplicationFiled: October 27, 2015Publication date: January 12, 2017Inventors: Boon Hua HOW, Kok Keong ONG, Chiang Huan SAW, See Jean CHAN, Wee Tick LO
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Publication number: 20070238274Abstract: A method is for making a spintronic device and may include forming at least one superlattice and at least one electrical contact coupled thereto, with the at least one superlattice including a plurality of groups of layers. Each group of layers may include a plurality of stacked base semiconductor monolayers defining a base semiconductor portion having a crystal lattice, at least one non-semiconductor monolayer constrained within the crystal lattice of adjacent base semiconductor portions, and a spintronic dopant. The spintronic dopant may be constrained within the crystal lattice of the base semiconductor portion by the at least one non-semiconductor monolayer. In some embodiments, the repeating structure of a superlattice may not be needed.Type: ApplicationFiled: March 16, 2007Publication date: October 11, 2007Applicants: RJ Mears, LLCInventors: Xiangyang HUANG, Samed HALILOV, Jean Chan Sow Fook YIPTONG, Ilija DUKOVSKI, Marek HYTHA, Robert MEARS
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Publication number: 20050173697Abstract: A semiconductor device may include a substrate and at least one MOSFET adjacent the substrate including a superlattice. The superlattice may include a plurality of stacked groups of layers and a semiconductor cap layer on an uppermost group of layers. Each group of layers of the superlattice may comprise a plurality of stacked base semiconductor monolayers defining a base semiconductor portion and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions. The MOSFET may further include source, drain, and gate regions defining a channel through at least a portion of the semiconductor cap layer.Type: ApplicationFiled: January 25, 2005Publication date: August 11, 2005Applicant: RJ MEARS, LLCInventors: Robert Mears, Jean Chan Sow Fook Yiptong, Marek Hytha, Scott Kreps, Ilija Dukovski
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Patent number: 6325964Abstract: A method of manufacturing a high-density titanium alloy article is disclosed. The method comprises a mixing and granulating step, a high-pressure molding step, and a high-temperature sintering step. Moreover, by means of selecting proper size of titanium raw powder and granulating the titanium raw powder and other metallic powder into titanium-based grains, a titanium alloy article having a high density is obtainable.Type: GrantFiled: September 18, 2000Date of Patent: December 4, 2001Assignee: New Century Technology Co., Ltd.Inventors: Jean Chan, Chin-Liang Cheng