Abstract: The method of fabricating a multi-level, metallic microstructure includes the steps consisting in structuring a first layer of photosensitive resin so as to obtain a first level of a resin mould, the aperture in the first resin layer revealing a conductive surface of a substrate, structuring a second photosensitive resin layer over the first level of a resin mould so as to obtain a multi-level resin mould, the apertures in the multi-level mould revealing the conductive surface of the substrate, galvanically depositing a metal or alloy in the apertures of the multi-level resin mould and separating a multi-level metallic structure formed by the metal or alloy deposited in the apertures from the substrate and the multi-level resin mould.

Abstract: The invention relates to a method (1) of manufacturing a silicon-metal composite micromechanical component (51) combining DRIE and LIGA processes. The invention also relates to a micromechanical component (51) including a layer wherein one part (53) is made of silicon and another part (41) of metal so as to form a composite micromechanical component (51). The invention concerns the field of timepiece movements.

Abstract: The invention concerns a method of fabricating a metallic microstructure, characterized in that it includes the steps consisting in forming a photosensitive resin mold by a LIGA-UV type process, and in the uniform, galvanic deposition of a layer of a first metal and then a layer of a second metal form a block, which approximately reaches the top surface of the photosensitive resin.

Abstract: The invention relates to a method (1) of manufacturing a silicon-metal composite micromechanical component (51) combining DRIE and LIGA processes. The invention also relates to a micromechanical component (51) including a layer wherein one part (53) is made of silicon and another part (41) of metal so as to form a composite micromechanical component (51). The invention concerns the field of timepiece movements.

Abstract: The method of fabricating a multi-level, metallic microstructure includes the steps consisting in: a) taking a substrate (1) that has a conductive surface (2); b) covering the conductive surface (2) with a first layer of photosensitive resin (3); c) irradiating the first layer of photosensitive resin (3) through a mask (4) that matches the desired pattern cavity; d) developing the first layer of photosensitive resin (3) so as to hollow out apertures therein and thus obtain a first level of a resin mould, the aperture in the first resin layer revealing the conductive surface (2) of the substrate; e) depositing a new layer of photosensitive resin (6) over the developed resin layer (3), so as to cover the latter and, preferably, to fill the apertures therein; f) irradiating the new photosensitive resin layer (6) through a mask (7) that matches the desired pattern cavity; g) developing the new photosensitive resin layer (6) so as to hollow out apertures therein and to obtain a multi-level resin mould, the aper

Abstract: The invention concerns a method of fabricating a metallic microstructure, characterized in that it includes the steps consisting in forming a photosensitive resin mould by a LIGA-UV type process, and in the uniform, galvanic deposition of a layer of a first metal and then a layer of a second metal form a block, which approximately reaches the top surface of the photosensitive resin.

Abstract: The invention relates to a method (1) of manufacturing a silicon-metal composite micromechanical component (51) combining DRIE and LIGA processes. The invention also relates to a micromechanical component (51) including a layer wherein one part (53) is made of silicon and another part (41) of metal so as to form a composite micromechanical component (51). The invention concerns the field of timepiece movements.