Abstract: The invention relates to a device (2) for transferring heat from a thermally conductive plate (30) capable of capturing the heat from a zone placed on a first side (32) of the plate, the device comprising at least one fin (35) placed on a second side (34) of the plate (30) opposite the first side (32) and having a duct (36) extending in a longitudinal direction (L) between a first end (38) connected to the plate and a second end (40) opposite the first end and which opens out, the duct (36) being connected to at least one Venturi-effect neck (42) bringing cooling air into the duct, the neck (42) being formed in the vicinity of the first end of the duct and the plate (30).

Abstract: The method comprises the following successive steps: — depositing sintering material (26) onto one of an electronic component (28) and a substrate (30); — heating the material (26) so as to bring a temperature of the material to a preliminary exothermic peak, which precedes an exothermic sintering peak, without the temperature of the material reaching a maximum of the preliminary exothermic peak; — fastening the other of the component (28) and the substrate (30) to the material (26) so that the material is interposed between the component and the substrate; and— pressing the material (26) while hot so as to cause it to creep.

Abstract: A device for measuring the mass flow rate, including a flow pipe; a first set of actuators which are arranged in a first plane including a first transverse cross section of the pipe and perpendicular to the fluid flow path, these being configured to move selectively in the first plane; a control circuit configured to control a movement of the first and second actuators so that the cross-sectional area for flow through the pipe in the first plane remains constant; a measurement sensor measuring a force or a stress in a direction perpendicular to the flow path, in the vicinity of the actuators of the first set along the flow path; a computation device configured to calculate the mass flow rate passing through the flow pipe as a function of the force or stress measured by the sensor.

Abstract: The invention relates to a device (2) for transferring heat from a thermally conductive plate (3) capable of capturing the heat from a zone placed on a first side (32) of the plate, the device comprising at least one fin (35) placed on a second side (34) of the plate (30) opposite the first side (32) and having a duct (36) extending in a longitudinal direction (L) between a first end (38) connected to the plate and a second end (4) opposite the first end and which opens out, the duct (36) being connected to at least one Venturi-effect neck (42) bringing cooling air into the duct, the neck (42) being formed in the vicinity of the first end of the duct and the plate (30).

Abstract: A conductive metal frame for a power electronics module comprising at least first and second power semiconductor components each having upper and lower faces, connectors for linking these power semiconductor components to external electrical circuits and at least one radiator for expelling via the conductive metal frame the heat flow generated by the power semiconductor components, the conductive metal frame being characterized in that the connectors, the at least one radiator and the conductive metal frame forming a single three-dimensional part made of a single material on an inner surface of which the first and second power semiconductor components are intended to be attached by their lower faces and provision is made for a central folding line so that, once the conductive metal frame is folded on itself, enclosing the first and second power semiconductor components, it provides a double-sided cooling assembly.

Abstract: An electrical power module comprising power components and supports, each including at least one metal portion, the metal portions of the supports forming a substrate of the electrical power module, at least one support comprising two angled metal portions that are angled relative to each other at an angle that is greater than 0°, each power component being fastened to two metal portions of two distinct supports by being positioned between said two metal portions, the electrical power module being arranged in such a manner that electrical power currents going to or coming from the power components flow in the metal portions of the supports.

Abstract: A device having both an electronic assembly having an electronic component assembled on a first substrate, and also a body defining a cavity having a first end in fluid flow communication with a fluid, the electronic component extending inside the cavity and the first substrate including a portion in contact with a wall of the cavity. The coefficient of thermal expansion of the material of the first substrate is less than that of the electronic component, and the electronic component is assembled on the first substrate by a brazing type assembly method involving the application of heat. A method of making an electronic assembly. An assembly obtained by the method.

Abstract: A pressure measurement device (1) comprising a housing (20) extending around an electronic card (30) provided with a pressure sensor (40); the housing (20) co-operating with a first face (31) of the electronic card (30) to define a first sealed volume (3); the housing (20) also co-operating with a second face (32) of the electronic card (30) that is opposite from the first face (31) to define a second sealed volume (4); the housing (20) including at least one first channel (24) putting the medium (5) outside the housing (20) into fluid flow communication with the first sealed volume (3); the electronic card (30) including at least one second channel (33) putting the first volume (3) into fluid flow communication with the second volume (4); and the connection between the housing (20) and the electronic card (30) being arranged to allow relative movement between the housing (20) and the electronic card.

Abstract: A pressure measurement device (1) comprising a housing (20) extending around an electronic card (30) provided with a pressure sensor (40); the housing (20) co-operating with a first face (31) of the electronic card (30) to define a first sealed volume (3); the housing (20) also co-operating with a second face (32) of the electronic card (30) that is opposite from the first face (31) to define a second sealed volume (4); the housing (20) including at least one first channel (24) putting the medium (5) outside the housing (20) into fluid flow communication with the first sealed volume (3); the electronic card (30) including at least one second channel (33) putting the first volume (3) into fluid flow communication with the second volume (4); and the connection between the housing (20) and the electronic card (30) being arranged to allow relative movement between the housing (20) and the electronic card.

Abstract: A device having both an electronic assembly having an electronic component assembled on a first substrate, and also a body defining a cavity having a first end in fluid flow communication with a fluid, the electronic component extending inside the cavity and the first substrate including a portion in contact with a wall of the cavity. The coefficient of thermal expansion of the material of the first substrate is less than that of the electronic component, and the electronic component is assembled on the first substrate by a brazing type assembly method involving the application of heat. A method of making an electronic assembly. An assembly obtained by the method.

Abstract: A device for measuring the mass flow rate, including a flow pipe; a first set of actuators which are arranged in a first plane including a first transverse cross section of the pipe and perpendicular to the fluid flow path, these being configured to move selectively in the first plane; a control circuit configured to control a movement of the first and second actuators so that the cross-sectional area for flow through the pipe in the first plane remains constant; a measurement sensor measuring a force or a stress in a direction perpendicular to the flow path, in the vicinity of the actuators of the first set along the flow path; a computation device configured to calculate the mass flow rate passing through the flow pipe as a function of the force or stress measured by the sensor.

Abstract: A pressure measurement device comprising a pressure sensor of a first type and a pressure sensor of a second type different from the first, which sensors are mounted on a common support in order to be subjected to the same pressure, in which the pressure sensor of the first type is of the capacitive type, the device being characterized in that the pressure sensor of the first type comprises at least one membrane and a first internal channel passing through the common support, a second internal channel bringing a fluid to the membrane being in fluid flow connection with the first internal channel. A calibration method associated with the device.

Abstract: An assembly method for assembling a first element to a second element by pressureless metal sintering, the method having a preparation step during which a sintering material is arranged at a bond interface of the elements, a pre-sintering step during which the assembly is heated for a first duration that is longer than five minutes at a first temperature that is higher than 200° C. and strictly lower than or equal to the temperature for activating diffusion at the grain boundaries, and a densification step during which the assembly is heated for a second duration at a second temperature that is higher than or equal to the temperature for activating diffusion at the grain boundaries.

Abstract: An electrical power module comprising power components and supports, each including at least one metal portion, the metal portions of the supports forming a substrate of the electrical power module, at least one support comprising two angled metal portions that are angled relative to each other at an angle that is greater than 0°, each power component being fastened to two metal portions of two distinct supports by being positioned between said two metal portions, the electrical power module being arranged in such a manner that electrical power currents going to or coming from the power components flow in the metal portions of the supports.

Abstract: A pressure measurement device comprising a pressure sensor of a first type and a pressure sensor of a second type different from the first, which sensors are mounted on a common support in order to be subjected to the same pressure, in which the pressure sensor of the first type is of the capacitive type, the device being characterized in that the pressure sensor of the first type comprises at least one membrane and a first internal channel passing through the common support, a second internal channel bringing a fluid to the membrane being in fluid flow connection with the first internal channel. A calibration method associated with the device.

Abstract: A pressure measurement device comprising a pressure sensor of a first type and a pressure sensor of a second type different from the first, which sensors are mounted on a common support in order to be subjected to the same pressure, in which the pressure sensor of the first type is of the capacitive type, the device being characterized in that the pressure sensor of the first type comprises at least one membrane and a first internal channel passing through the common support, a second internal channel bringing a fluid to the membrane being in fluid flow connection with the first internal channel. A calibration method associated with the device.

Abstract: An electronic system including at least one component, two identical packages including a bottom from which a peripheral rim protrudes defining a recess, and electrical conductors passing through each package, the packages being attached to one another by the rim thereof so as to define a sealed cavity therebetween. An electronic device including two systems of this type superimposed on one another.

Abstract: A pressure measuring device comprising a bracket supporting a pressure sensor which defines a first sealed enclosure with a first face of the bracket, with the pressure measuring device comprising a substrate having opposite faces, opposite which a first deformable membrane and a second deformable membrane respectively extend, with the first membrane and the second membrane respectively defining with the substrate a second sealed enclosure and a third sealed membrane, with the pressure sensor comprising a cover in order to define a fourth sealed enclosure connected through a second channel to the first enclosure, with the pressure sensor comprising means for measuring the deformation of the first and the second deformable membranes.

Abstract: A pressure detection device including a mount whereon a pressure sensor is attached which comprises a membrane which has a surface intended to be subjected to a pressurized fluid and which is so arranged as to elastically deform according to pressure, and means for determining the deformation of the membrane along an axis normal to a mid-plane of the membrane in the rest state. The membrane is supported by a frame connected to the mount by a mechanical decoupling structure in order to isolate the membrane from stress resulting from a differential thermal expansion between the frame and the mount, with the membrane and the frame being made of the same material.

Abstract: An assembly method for assembling a first element to a second element by pressureless metal sintering, the method having a preparation step during which a sintering material is arranged at a bond interface of the elements, a pre-sintering step during which the assembly is heated for a first duration that is longer than five minutes at a first temperature that is higher than 200° C. and strictly lower than or equal to the temperature for activating diffusion at the grain boundaries, and a densification step during which the assembly is heated for a second duration at a second temperature that is higher than or equal to the temperature for activating diffusion at the grain boundaries.