Abstract: The invention relates to a container (1) for containing foodstuff (F), which container comprises: a bottom (2); a peripheral wall (3) integral with the bottom (2) and extending upwardly from the bottom (2) and defining a mouth opening; a closing foil (5) arranged onto the mouth opening; at least one support element (4) arranged on the bottom (2) at a position corresponding to the edge (7) of the mouth opening, such that in a stacked position of at least two identical containers, the support element (4) of the first container rests on the edge (7) of the mouth opening of the second container. Furthermore the invention relates to a stack of containers, comprising at least a first and a second container according to any of the preceding claims, wherein the first container is stacked on top of the second container, and wherein the support element (4) of the first container rests on the edge (7) of the mouth opening of the second container.

Abstract: The method provides for molding the rear end portion 4 of a tubular body 2 made of plastic material on an end portion 5 of a cable adaptor 6. The tubular body 2 has windows 10 formed in a front end portion 3 thereof. A coil spring 21 and a ferrule holder 13 having wings 19 are inserted through the front end portion 3 of the tubular body 2 and forced therethrough so that the wings 19 expand radially the the front end portion 3 and the end walls 11 of the windows 10. When the wings 19 arrive in the windows 10, the end walls 11 and the front end portion 3 may re-contract radially so that the wings 19 may catch the end walls 11 under the bias of the coil spring 21.

Abstract: A method of bonding a sheet of metal such as copper on a substrate of aluminum nitride, the method comprising the following steps known per se: i) growing a layer of alumina on the aluminum nitride substrate by means of heat treatment; and ii) placing the sheet of metal on the alumina layer and then bonding them together; the method being wherein alumina-growing step i) is performed under a controlled oxidizing atmosphere which is free from moisture.

Abstract: Disclosed is a method for the direct bonding of a copper sheet to a substrate made of an electrically insulating material, with the heating of the copper/substrate set in order to obtain a eutectic mixture. The method according to the invention consists in cleaning the copper to eliminate traces of oxidation on its surface before placing said copper on the substrate, in heating the copper/substrate set under a neutral atmosphere until a temperature greater than the temperature for the formation of the eutectic mixture is reached, and in applying the oxidating reactive gas only after the temperature greater than the temperature for the formation of the eutectic mixture is reached, in such a way that this temperature is reached before any oxidation of the surface of the copper.

Abstract: A metallic alloy is cast in a mold to produce a solid body by unidirectional solidification. The alloy, initially in a molten state, is cast into a mold and is completely and progressively cooled in the mold while a unidirectional thermal gradient superimposed thereon parallel to a direction determined by the configuration of the mold (predetermined direction) until a metastable equilibrium is reached in which the entire body of the melt is in a super-cooled state as a homogeneous liquid. The equilibrium is then broken to cause solidification of the alloy and the formation of dendritic crystals with their principal axes parallel to the thermal gradient substantially instantly and without noticeable advance of a solidification front across the melt.