Abstract: An electronic device for generating an electric oscillating signal is described based on a micro-electromechanical system (MEMS). The electronic device typically comprises a substrate a moveable element which is moveable with respect to the substrate and an actuating means and a sensor. The actuating means is used to induce vibration of the moveable element and comprises two inductive elements, a first one provided fixed to the substrate and a second one provided fixed to the moveable element. The induced vibration of the moveable element is sensed using the sensor and converted into an electric oscillating signal.

Abstract: An electronic device for generating an electric oscillating signal is described based on a micro-electromechanical system (MEMS). The electronic device typically comprises a substrate (104) a moveable element (102) which is moveable with respect to the substrate (104) and an actuating means and a sensor. The actuating means is used to induce vibration of the moveable element (102) and comprises two inductive elements, a first one provided fixed to the substrate (104) and a second one provided fixed to the moveable element (102). The induced vibration of the moveable element (102) is sensed using the sensor and converted into an electric oscillating signal. The signal may be amplified and used for at least partly powering the actuating means, such that an oscillating signal at a stable resonance frequency and with a fixed amplitude can be obtained. The different components are highly integratable on chip.

Abstract: The invention relates to a method for connecting a connecting surface of a first silicon wafer [WA1] with a connecting surface of a second silicon wafer [WA2] so as to form an insulated cavity after assembly, at least one of the two silicon wafers [WA] including at least one functional area [DA] intended to be within the cavity. The method according to the invention includes a step [PLTS] of depositing alloy soldering bumps [PLTC] on the connecting surface of the first silicon wafer [WA1], said bumps [PLTC] being separated from one another by an even distance which is sufficiently small to cause joinings during the assembly of the two silicon wafers. Said step [PLTS] of depositing the soldering bumps [PLTE] is carried out during the step of depositing the soldering bumps [PLTE] intended for the electrical contacts. The method includes a reflux soldering step [RFX] for assembling the two silicon wafers by melting of the alloy soldering bumps.

Abstract: The invention relates to an electromechanical switching device including at least one pair of inductive elements electrically connected in series, said inductive elements being intended to generate two magnetic fields when current is flowing through said inductive elements, the interaction between these two fields resulting in a displacement of at least one of the inductive elements and a displacement of a mobile contact element linked to said at least one inductive element and intended to switch between two positions, at least one of these positions enabling an electrical connection between at least two conductive elements. The invention uses the mechanical forces exerted on at least one inductive element able to move thanks to two electro-magnetic fields oppositely generated by two inductive elements to activate a switch effect between two positions.

Abstract: The invention relates to an electromechanical switching device including at least one pair of inductive elements electrically connected in series, said inductive elements being intended to generate two magnetic fields when current is flowing through said inductive elements, the interaction between these two fields resulting in a displacement of at least one of the inductive elements and a displacement of a mobile contact element linked to said at least one inductive element and intended to switch between two positions, at least one of these positions enabling an electrical connection between at least two conductive elements. The invention uses the mechanical forces exerted on at least one inductive element able to move thanks to two electro-magnetic fields oppositely generated by two inductive elements to activate a switch effect between two positions.

Abstract: The invention relates to a method for connecting a connecting surface of a first silicon wafer [WA1] with a connecting surface of a second silicon wafer [WA2] so as to form an insulated cavity after assembly, at least one of the two silicon wafers [WA] including at least one functional area [DA] intended to be within the cavity. The method according to the invention includes a step [PLTS] of depositing alloy soldering bumps [PLTC] on the connecting surface of the first silicon wafer [WA1], said bumps [PLTC] being separated from one another by an even distance which is sufficiently small to cause joinings during the assembly of the two silicon wafers. Said step [PLTS] of depositing the soldering bumps [PLTE] is carried out during the step of depositing the soldering bumps [PLTE] intended for the electrical contacts. The method includes a reflux soldering step [RFX] for assembling the two silicon wafers by melting of the alloy soldering bumps.

Abstract: The invention relates to a method of producing and modifying the contents of a picture memory ("mapped memory") by means of objects to be represented described in an object memory. When an object is arranged in the picture, the picture elements that were contained in the perimeter of the object before the latter was positioned were protected in the object memory (5) at the address of the description of the object and taking its place. For displacing an object, it is consequently sufficient to exchange the picture elements between the object memory and the picture to recreate the picture with the object and then to re-arrange the object in another position according to the same exchanging process.

Abstract: A burst transmission remote control system in which the information about the functions of N transmission channels are indicated by (N + 1) intervals between (N + 2) narrow pulses which are transmitted in repeated bursts, the duration of the intervals having two values defined by the presence or absence of information. The system includes a transmitter having cascaded trigger circuits, and a receiver having a binary/decimal decoder circuit.