Patents by Inventor Jean-Cyril Esther

Jean-Cyril Esther has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of modifying connecting leads and thinning bases of encapsulated modular electronic components to obtain a high-density module, and a module obtained thereby
    Patent number: 6683373
    Abstract: A method of obtaining a module (4), and the module obtained, from modular electronic components encapsulated in flat monoblock packages (1A) in which elements constituting the components are buried and from which project laterally conductive connecting leads (3A), the packages being stacked and buried in an insulative block corresponding to at least one module and the projecting connecting leads of the stacked packages being flush with a surface of the block, on at least one face of said block on which are formed conductive interconnection tracks and/or contacts for connecting the leads with connecting means external to the module. The method includes, before stacking the packages, an operation of modifying the connecting leads of the packages in order to reduce their overall size and an operation of reducing the height of the packages by thinning their respective bases.
    Type: Grant
    Filed: May 10, 2002
    Date of Patent: January 27, 2004
    Assignee: Alcatel
    Inventors: Olivier Vendier, Norbert Venet, Philippe Calvel, Stéphane Albinet, Jean-Cyril Esther, Marc Huan