Patents by Inventor JEAN DALMON

JEAN DALMON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10114055
    Abstract: Apparatus for testing a device by delivering an electrostatic discharge signal to one or more device terminals, comprising a first part configured for mechanically mounting the device and comprising one or more first part connectors for electrically coupling to the one or more device terminals and thus providing electrical access to the one or more device terminals, a second part comprising one or more second part connectors configured for electrically coupling the one or more first part connectors to the one or more second part connectors for testing the device via the second part connectors, and a guide arranged for mechanically moving the first part relative to the second part. The guide is configured to physically disconnect the one or more first part connectors from the one or more second part connectors while the electrostatic discharge signal is delivered to the one or more device terminals.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: October 30, 2018
    Assignee: NXP USA, Inc.
    Inventors: Alain Salles, Jean Dalmon, Roger Stivanin
  • Patent number: 9874602
    Abstract: The invention provides a test board support platform for supporting a test board during tests, the platform comprising a heat conductive interface arranged to contact a bottom side of the test board at a first side of the heat conductive interface. The support platform also comprises a thermal conditioner coupled to a second side of the heat conductive interface, the second side being opposite the first side. By using this test board support platform a test board can be supported and thermally controlled in a way so that a DUT positioned on the test board can be probed from above, while the temperature is controlled from below.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: January 23, 2018
    Assignee: NXP USA, Inc.
    Inventors: Christian Jean-Gabriel Vincent, Jean Dalmon, Pierre Michel Georges Jalbaud
  • Publication number: 20170160326
    Abstract: Apparatus for testing a device by delivering an electrostatic discharge signal to one or more device terminals, comprising a first part configured for mechanically mounting the device and comprising one or more first part connectors for electrically coupling to the one or more device terminals and thus providing electrical access to the one or more device terminals, a second part comprising one or more second part connectors configured for electrically coupling the one or more first part connectors to the one or more second part connectors for testing the device via the second part connectors, and a guide arranged for mechanically moving the first part relative to the second part. The guide is configured to physically disconnect the one or more first part connectors from the one or more second part connectors while the electrostatic discharge signal is delivered to the one or more device terminals.
    Type: Application
    Filed: November 30, 2016
    Publication date: June 8, 2017
    Inventors: Alain Salles, Jean Dalmon, Roger Stivanin
  • Publication number: 20160109510
    Abstract: The invention provides a test board support platform for supporting a test board during tests, the platform comprising a heat conductive interface arranged to contact a bottom side of the test board at a first side of the heat conductive interface. The support platform also comprises a thermal conditioner coupled to a second side of the heat conductive interface, the second side being opposite the first side. By using this test board support platform a test board can be supported and thermally controlled in a way so that a DUT positioned on the test board can be probed from above, while the temperature is controlled from below.
    Type: Application
    Filed: March 17, 2015
    Publication date: April 21, 2016
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: CHRISTIAN JEAN-GABRIEL VINCENT, JEAN DALMON, PIERRE MICHEL GEORGES JALBAUD