Patents by Inventor Jean Demey

Jean Demey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible thermoplastic structures with multiple coextruded polymeric layers comprising a vinylidene chloride copolymer layer bonded to a plasticized vinyl chloride polymer layer
    Patent number: 4774146
    Abstract: The flexible thermoplastic structures comprise a vinylidene chloride copolymer layer bonded to a plasticized vinyl chloride polymer layer through the intermediacy of a mixture of polymeric adhesives consisting of 10 to 90 parts by weight of a copolymer of vinyl acetate and ethylene and of 90 to 10 parts by weight of a copolymer of vinyl chloride and vinyl acetate and whose shear elastic modulus G' at 121.degree. C. and 10.sup.-4 cycles/second is greater than 0.5 10.sup.3 Pa.The flexible thermoplastic structures with coextruded polymeric layers may be in the form of films, sheets, tetra-packs or flexible pouches capable of being employed in the packaging field.
    Type: Grant
    Filed: July 10, 1987
    Date of Patent: September 27, 1988
    Assignee: Solvay & CIE
    Inventors: Claude Dehennau, Jean Demey