Patents by Inventor Jean-François Revel

Jean-François Revel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Forming of the last metallization level of an integrated circuit
    Patent number: 7919864
    Abstract: An integrated circuit including one or several metallization levels, metal conductive strips and metal contact pads being formed on the last metallization level, the last level being covered with a passivation layer in which are formed openings above the contact pads. The thickness of the pads, at least at the level of their portions not covered by the passivation layer, is smaller than the thickness of said conductive strips.
    Type: Grant
    Filed: March 2, 2004
    Date of Patent: April 5, 2011
    Assignee: STMicroelectronics S.A.
    Inventors: Jacky Seiller, Jean-François Revel, Claude Douce
  • Forming of the last metallization level of an integrated circuit
    Publication number: 20050077626
    Abstract: An integrated circuit including one or several metallization levels, metal conductive strips and metal contact pads being formed on the last metallization level, the last level being covered with a passivation layer in which are formed openings above the contact pads. The thickness of the pads, at least at the level of their portions not covered by the passivation layer, is smaller than the thickness of said conductive strips.
    Type: Application
    Filed: March 2, 2004
    Publication date: April 14, 2005
    Inventors: Jacky Seiller, Jean-Francois Revel, Claude Douce