Abstract: The present invention relates to a method for forming a metal deposit on the surface of a solid substrate, said method including at least: 1) a step of functionalizing the surface of the substrate by means of —O—P, —O—P—O, —O—S, or —O—S—O groupings; 2) a step of mixing the substrate with metal or metal-oxide particles sublimated at a low temperature; 3) a step of heat-treating the substrate obtained above after step 2), it being understood that said step 3) is only carried out when metal is utilized in the above step 2), said step 3) also being carried out at a temperature that is lower than the temperature for melting the metal in question and further being carried out in the air so as to oxidize said metal; and 4) a step of reducing the metal oxide obtained in step 3) or the metal oxide utilized in step 2) in a reducing atmosphere at a temperature of 0.

Abstract: The present invention relates to a method for forming a metal deposit on the surface of a solid substrate, said method including at least: 1) a step of functionalizing the surface of the substrate by means of —O—P, —O—P—O, —O—S, or —O—S—O groupings; 2) a step of mixing the substrate with metal or metal-oxide particles sublimated at a low temperature; 3) a step of heat-treating the substrate obtained above after step 2), it being understood that said step 3) is only carried out when metal is utilized in the above step 2), said step 3) also being carried out at a temperature that is lower than the temperature for melting the metal in question and further being carried out in the air so as to oxidize said metal; and 4) a step of reducing the metal oxide obtained in step 3) or the metal oxide utilized in step 2) in a reducing atmosphere at a temperature of 0.

Abstract: Process for manufacturing composite metal/ceramic thin films, consisting of: a) preparing a suspension (S) in an organic solvent starting from a substantially homogenous mixture of ceramic reinforcements, metallic particles, a binder, a plasticizer and a dispersant, the metallic particles constituting at least 5% by weight of the suspension; b) tape casting the suspension to form a thin film, and then de-binding said thin film; c) densifying the de-binded thin film in a furnace.

Abstract: The invention concerns a method for making thin films in metal/ceramic composite, characterized in that it consists in: a) preparing a suspension (S) in an organic solvent from a substantially homogeneous mixture of ceramic reinforcements of metal particles, a binder, a plasticizing agent and an organic dispersant, the metal particles constituting at least 5 wt. % of the suspension; b) tape casting the suspension (S) to form a thing film (B), then culminating organic compounds contained in the binder and the plasticizing agent from said thin film; c) densifying the thin film from which said organic compounds have been removed in an oven.

Abstract: The invention concerns a method for making thin films in metal/ceramic composite, characterised in that it consists in a) preparing a suspension (S) in an organic solvent from a substantially homogeneous mixture of ceramic reinforcements of metal particles, a binder, a plasticizing agent and an organic dispersant, the metal particles constituting at least 5 wt. % of the suspension; b) tape casting the suspension (S) to form a thing film (B), then climinating organic compounds contained in the binder and the plasticizing agent from said thin film; c) densifying the thin film from which said organic compounds have been removed in an oven.

Abstract: To improve the resistance of a solder to strains, especial thermal strains, superelastic particles are incorporated into the solder in a proportion by volume of 10 to 30% approximately. So that this incorporation can be done, the particles are coated with a metal, for example copper, that is wettable by the solder.