Patents by Inventor Jean-Francois Boschet

Jean-Francois Boschet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230020171
    Abstract: A method for producing an electronic document (30) comprising a concealed magnetic strip, comprising a step (22) of providing a surface (310) of an electronic document body (30), a step (23) of applying of a magnetic strip (33) to at least part of the surface (310) of the electronic document body (30), a visible surface (34), formed by the surface (310) of the body covered at least in part by the magnetic strip (33), having a Delta E contrast equal to or less than 15, and a step (24, 25, 26) of applying a decor (32) that covers the surface (310) of the body over the magnetic strip (33), the decor (32) having a thickness of at most 10 ?m and having an opacity ratio at wavelengths in the visible domain of at least 70%; and a corresponding electronic document (30).
    Type: Application
    Filed: December 16, 2020
    Publication date: January 19, 2023
    Inventors: Denis GUERARD, Jean-François BOSCHET
  • Patent number: 8864040
    Abstract: A fabrication method for a device having a body having a cavity of dimensions suitable for receiving a module having a microcircuit, the cavity having a bottom and a peripheral wall surrounding the bottom, the method including a step of putting the module into place in the cavity. More precisely, the method comprises, prior to the step of putting the module into place, a step of depositing an adhesive strip at least on a surface of the module that is designed to face the bottom of the cavity, the adhesive strip being suitable for enabling the module to adhere at least to the bottom of the cavity and for limiting a deformation stroke of the module that could occur under the effect of a mechanical compression force urging the module against the bottom of the cavity.
    Type: Grant
    Filed: December 5, 2011
    Date of Patent: October 21, 2014
    Assignee: Oberthur Technologies
    Inventors: Olivier Bosquet, Jean-Francois Boschet
  • Publication number: 20120138690
    Abstract: A fabrication method for a device having a body having a cavity of dimensions suitable for receiving a module having a microcircuit, the cavity having a bottom and a peripheral wall surrounding the bottom, the method including a step of putting the module into place in the cavity. More precisely, the method comprises, prior to the step of putting the module into place, a step of depositing an adhesive strip at least on a surface of the module that is designed to face the bottom of the cavity, the adhesive strip being suitable for enabling the module to adhere at least to the bottom of the cavity and for limiting a deformation stroke of the module that could occur under the effect of a mechanical compression force urging the module against the bottom of the cavity.
    Type: Application
    Filed: December 5, 2011
    Publication date: June 7, 2012
    Applicant: OBERTHUR TECHNOLOGIES
    Inventors: Olivier Bosquet, Jean-Francois Boschet