Patents by Inventor Jean-Francois Drouard

Jean-Francois Drouard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package having integrated faraday shield
    Patent number: 8049119
    Abstract: A packaged integrated circuit (IC) (100) includes a first substrate (110) comprising a first plurality of layers and a first circuit coupling features (112) at an upper surface of the first substrate (110), the first plurality of layers including a first electromagnetic interference shielding layer (132). The packaged IC also includes a second substrate (106) having an upper surface attached to a lower surface of the first substrate (110) by an electrically conductive adhesive material (136). The second substrate (106) includes a second plurality of layers and a second circuit coupling feature (108) at a lower surface of the second substrate (106). The first plurality of layer includes a second EMI shielding layer (134). The packaged IC further includes a functional die (124) disposed between the first (110) and the second (106) substrates and functionally coupled to the first (112) and/or the second (108) circuit coupling features.
    Type: Grant
    Filed: May 7, 2010
    Date of Patent: November 1, 2011
    Assignee: Texas Instruments Incorporated
    Inventors: Stanley C Beddingfield, Jean-Francois Drouard
  • Integrated Circuit Package Having Integrated Faraday Shield
    Publication number: 20100214759
    Abstract: A packaged integrated circuit (IC) (100) includes a first substrate (110) comprising a first plurality of layers and a first circuit coupling features (112) at an upper surface of the first substrate (110), the first plurality of layers including a first electromagnetic interference shielding layer (132). The packaged IC also includes a second substrate (106) having an upper surface attached to a lower surface of the first substrate (110) by an electrically conductive adhesive material (136). The second substrate (106) includes a second plurality of layers and a second circuit coupling feature (108) at a lower surface of the second substrate (106). The first plurality of layer includes a second EMI shielding layer (134). The packaged IC further includes a functional die (124) disposed between the first (110) and the second (106) substrates and functionally coupled to the first (112) and/or the second (108) circuit coupling features.
    Type: Application
    Filed: May 7, 2010
    Publication date: August 26, 2010
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Stanley Craig BEDDINGFIELD, Jean-Francois DROUARD
  • Integrated circuit package having integrated faraday shield
    Patent number: 7741567
    Abstract: A packaged integrated circuit (IC) (100) includes a first substrate (110) including a first plurality of layers and first circuit coupling features (112) at an upper surface of the first substrate (110). The first plurality of layers include a first electromagnetic interference shielding layer (132). The packaged IC also includes a second substrate (106) having an upper surface attached to a lower surface of the first substrate (110) by an electrically conductive adhesive material (136). The second substrate (106) includes a second plurality of layers and a second circuit coupling feature (108) at a lower surface of the second substrate (106). The first plurality of layers includes a second EMI shielding layer (134). The packaged IC further includes a functional die (124) disposed between the first (110) and the second (106) substrates and functionally coupled to the first (112) and/or the second (108) circuit coupling features.
    Type: Grant
    Filed: May 19, 2008
    Date of Patent: June 22, 2010
    Assignee: Texas Instruments Incorporated
    Inventors: Stanley Craig Beddingfield, Jean-Francois Drouard
  • INTEGRATED CIRCUIT PACKAGE HAVING INTEGRATED FARADAY SHIELD
    Publication number: 20090284947
    Abstract: A packaged integrated circuit (IC) (100) includes a first substrate (110) including a first plurality of layers and first circuit coupling features (112) at an upper surface of the first substrate (110). The first plurality of layers include a first electromagnetic interference shielding layer (132). The packaged IC also includes a second substrate (106) having an upper surface attached to a lower surface of the first substrate (110) by an electrically conductive adhesive material (136). The second substrate (106) includes a second plurality of layers and a second circuit coupling feature (108) at a lower surface of the second substrate (106). The first plurality of layers includes a second EMI shielding layer (134). The packaged IC further includes a functional die (124) disposed between the first (110) and the second (106) substrates and functionally coupled to the first (112) and/or the second (108) circuit coupling features.
    Type: Application
    Filed: May 19, 2008
    Publication date: November 19, 2009
    Inventors: Stanley Craig Beddingfield, Jean-Francois Drouard