Patents by Inventor Jean-Francois Garneau

Jean-Francois Garneau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6112976
    Abstract: The disclosed invention provides for a method of manufacturing solder columns for particular use in attaching substrates to a printed circuit board. The method results in columns of homogeneous composition and thus overcomes problems associated with the phenomena of segregation. The method includes the steps of forming particles of the metal composition to be used for the columns from a molten source of the composition. The solid particles are then formed into segments of homogeneous composition by drawing ingots of the composition into wire and severing the wire into segments.
    Type: Grant
    Filed: May 27, 1998
    Date of Patent: September 5, 2000
    Assignee: International Business Machines Corporation
    Inventors: Louis-Marie Achard, Claude Blais, David Hirsch Danovitch, Jean-Francois Garneau, Michel Robert