Patents by Inventor Jean-Francois Vaccani

Jean-Francois Vaccani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for testing a semiconductor package
    Patent number: 8159244
    Abstract: A method and system for testing a semiconductor package. At least some of the illustrative embodiments are methods comprising testing a semiconductor package unit (150, 420) by electrically coupling a top printed circuit board (208, 420) to a top-side of a semiconductor package unit (150, 420), the coupling using electrically conductive top-side pogo pins (201A, 420), and a pair of adjacent top-side pogo pins (201A, 420) bridged using an electrically conductive path (302, 420), electrically coupling a bottom printed circuit board (210, 430) to a bottom-side of the semiconductor package unit (150, 430), the coupling using electrically conductive bottom-side pogo pins (201B, 430), said top-side pogo pins (201A, 430) and said bottom-side pogo pins are of substantially equal height (201B, 430), and transmitting test signals from the bottom printed circuit board to the semiconductor device package by way of the bottom-side pogo pins (210, 440).
    Type: Grant
    Filed: November 24, 2008
    Date of Patent: April 17, 2012
    Assignee: Texas Instruments Incorporated
    Inventor: Jean-Francois Vaccani
  • METHOD AND SYSTEM FOR TESTING A SEMICONDUCTOR PACKAGE
    Publication number: 20090121735
    Abstract: A method and system for testing a semiconductor package. At least some of the illustrative embodiments are methods comprising testing a semiconductor package unit (150, 420) by electrically coupling a top printed circuit board (208, 420) to a top-side of a semiconductor package unit (150, 420), the coupling using electrically conductive top-side pogo pins (201A, 420), and a pair of adjacent top-side pogo pins (201A, 420) bridged using an electrically conductive path (302, 420), electrically coupling a bottom printed circuit board (210, 430) to a bottom-side of the semiconductor package unit (150, 430), the coupling using electrically conductive bottom-side pogo pins (201B, 430), said top-side pogo pins (201A, 430) and said bottom-side pogo pins are of substantially equal height (201B, 430), and transmitting test signals from the bottom printed circuit board to the semiconductor device package by way of the bottom-side pogo pins (210, 440).
    Type: Application
    Filed: November 24, 2008
    Publication date: May 14, 2009
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Jean-Francois VACCANI
  • Miniature device for receiving and playing back sound with piezoelectric component as combination microphone/loud speaker
    Patent number: 6028752
    Abstract: Sound recording and playback device comprising a sound pick-up microphone connected to a recording channel and a playback loudspeaker connected to a channel for playing the recorded sounds, characterised in that the microphone and the loudspeaker consist of one and the same component (5).
    Type: Grant
    Filed: August 14, 1997
    Date of Patent: February 22, 2000
    Assignee: Texas Instruments Incorporated
    Inventors: Michel Chomette, Jean-Francois Vaccani, Philippe Tort