Abstract: In a method, substrate elements are provided wherein each substrate element has a first side and a second side meeting at a corner point. The substrate elements are picked and then placed on a support device in alignment. A cutting operation is then performed where each of the substrates elements are cut along a cut line having a common first direction which intersects the first and second sides of each of the substrate elements in order to create a third side on each substrate element. The third side of each of the substrate elements meets the first and the second sides at corresponding corner points.

Abstract: An electronic package includes at least one heat-transfer element interposed between a front side of an integrated-circuit chip and a back side of a heat-transfer plate. An encapsulation block has a portion lying between the front side of the integrated-circuit chip and the back side of the heat-transfer plate. The portion embeds the heat-transfer element. Another heat transfer element is interposed between a front side of a electrical-connection support plate and a rim portion of the heat-transfer plate.