Abstract: A method of manufacturing semiconductor devices comprising a layer of semiconductor material, comprising the steps of providing a strip-shaped solid substrate having a main surface and providing a solid support having a substantially horizontal surface and comprising a substantially floating liquid mass of such semiconductor material on the substantially horizontal surface, the main surface being wettable by the liquid semiconductor material. The liquid mass is contacted with the main surface of said substrate, onto which substrate the layer of semiconductor material is to be provided, the substrate is moved in its longitudinal direction along and in contact with said liquid mass so that a liquid layer of said semiconductor material is formed on said strip and taken along with it, and the liquid layer is substantially progressively solidified.