Abstract: The invention relates to the plating of conductive components by electrolytic deposition.An electroplating device in accordance with the invention comprises at least one electrolytic cell containing a tubular anode and having inlet and outlet connections for a bath of electrolyte flowing longitudinally through the anode. A removable component-holder of the device comprising means for gripping a component for plating, which component holder is electrically connected to a cathode-supply plate and is adapted to be mounted on the cell to close it and suspend the component along the axis of the anode.The device can be used inter alia for plating with hard chromium.