Patents by Inventor Jean K. Vangsness

Jean K. Vangsness has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
    Patent number: 6890244
    Abstract: A polishing pad for polishing semiconductors and other planar substrates in the presence of a slurry comprising abrasive particles and a dispersive agent is disclosed. The polishing pad includes a soluble component within a polymer matrix component. The soluble component includes particles soluble in the slurry sufficiently to provide a void structure in the polishing surface of the pad. The void structure enhances the polishing rate and uniformity by increasing the mobility of the abrasive particles while reducing scratching of the polished surface. Additives that further enhance polishing and/or assist in the removal of residues generated during polishing, such as surfactants and removers, are optionally incorporated in the soluble particles or topographically coated on the soluble particles.
    Type: Grant
    Filed: September 18, 2003
    Date of Patent: May 10, 2005
    Assignee: Freudenberg Nonwovens Limited Partnership
    Inventors: Oscar K. Hsu, Jean K. Vangsness, Scott C. Billings, David S. Gilbride
  • Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
    Publication number: 20040072507
    Abstract: A polishing pad for polishing semiconductors and other planar substrates in the presence of a slurry comprising abrasive particles and a dispersive agent is disclosed. The polishing pad includes a soluble component within a polymer matrix component. The soluble component includes particles soluble in the slurry sufficiently to provide a void structure in the polishing surface of the pad. The void structure enhances the polishing rate and uniformity by increasing the mobility of the abrasive particles while reducing scratching of the polished surface. Additives that further enhance polishing and/or assist in the removal of residues generated during polishing, such as surfactants and removers, are optionally incorporated in the soluble particles or topographically coated on the soluble particles.
    Type: Application
    Filed: September 18, 2003
    Publication date: April 15, 2004
    Applicant: FREUDENBERG NONWOVENS LIMITED PARTNERSHIP
    Inventors: Oscar K. Hsu, Jean K. Vangsness, Scott C. Billings, David S. Gilbride
  • Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
    Patent number: 6656018
    Abstract: A polishing pad for polishing semiconductors and other planar substrates in the presence of a slurry comprising abrasive particles and a dispersive agent is disclosed. The polishing pad includes a soluble component, preferably fibrous, within a polymer matrix component. The fibrous component includes fibers soluble in the slurry sufficiently to provide a void structure in the polishing surface of the pad. The void structure enhances the polishing rate and uniformity by increasing the mobility of the abrasive particles while reducing scratching of the polished surface. Additives that further enhance polishing and/or assist in the removal of residues generated during polishing, such as surfactants and removers, are optionally incorporated in the fibrous substance or topographically coated on the fibrous substance.
    Type: Grant
    Filed: April 10, 2000
    Date of Patent: December 2, 2003
    Assignee: Freudenberg Nonwovens Limited Partnership
    Inventors: Oscar K. Hsu, Jean K. Vangsness, Scott C. Billings, David S. Gilbride