Patents by Inventor Jean Labelle

Jean Labelle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for the encapsulation of integrated circuits
    Patent number: 4857483
    Abstract: To encapsulate integrated circuits mounted on continuous dielectrical strips (surface-mounted circuits) it is proposed to transfer mold a thermosetting resin around circuits carried by the strip, the resin being injected outside the parting plane of the mold, contrary to the usual practice in this field. The protection of the circuits is improved while, at the same time, the ability to test the strip is preserved.
    Type: Grant
    Filed: December 29, 1987
    Date of Patent: August 15, 1989
    Assignee: SGS-Thomson Microelectronics S.A.
    Inventors: Francis Steffen, Jean Labelle