Patents by Inventor Jean-Laurent Deborde

Jean-Laurent Deborde has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Selecting a substrate to be soldered to a carrier
    Patent number: 10141199
    Abstract: A method for soldering an insulating substrate onto a substrate mounting portion of a carrier by a predefined solder is provided. The insulating substrate includes a dielectric insulation carrier, a top side, and a bottom side opposite to the top side. The method includes selecting the insulating substrate based on a criterion which indicates that the insulating substrate, if it has the solidus temperature of the solder, has a positive unevenness. The insulating substrate is soldered on the bottom side to the substrate mounting portion, such that, after the soldering, the solidified solder extends continuously from the bottom side of the insulating substrate as far as the substrate mounting portion. The top side of the insulating substrate is populated with at least one semiconductor chip.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: November 27, 2018
    Assignee: Infineon Technologies AG
    Inventors: Charles Rimbert-Riviere, Jean-Laurent Deborde, Martin Haller, Nils Alexander Sanetra, Vasile Vartolomei
  • Method for Soldering an Insulating Substrate onto a Carrier
    Publication number: 20170062241
    Abstract: A method for soldering an insulating substrate onto a substrate mounting portion of a carrier by a predefined solder is provided. The insulating substrate includes a dielectric insulation carrier, a top side, and a bottom side opposite to the top side. The method includes selecting the insulating substrate based on a criterion which indicates that the insulating substrate, if it has the solidus temperature of the solder, has a positive unevenness. The insulating substrate is soldered on the bottom side to the substrate mounting portion, such that, after the soldering, the solidified solder extends continuously from the bottom side of the insulating substrate as far as the substrate mounting portion. The top side of the insulating substrate is populated with at least one semiconductor chip.
    Type: Application
    Filed: August 30, 2016
    Publication date: March 2, 2017
    Inventors: Charles Rimbert-Riviere, Jean-Laurent Deborde, Martin Haller, Nils Alexander Sanetra, Vasile Vartolomei